Method for manufacturing circuit board on which electronic component is mounted

1. A method for manufacturing a circuit board on which an electronic component is mounted, comprising:

(a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a board surface including a component mounting portion of a printed board on which a predetermined pattern is provided, to form an adhesive layer on the board surface either in whole or in part;

(b) irradiating the photo-polymerizable adhesive with ultraviolet light to cause the adhesive to turn into a gel, thereby providing adhesiveness to the adhesive layer; and

(c) placing and pressing the electronic component correspondingly against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, wherein the photo-polymerizable adhesive is a delayed reactive adhesive,

wherein, in the step (c), an inspection for electrical conduction between the electronic component and the component mounting portion is further carried out.

2. A method for manufacturing a circuit board on which an electronic component is mounted, comprising:

(a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a board surface including a component mounting portion of a printed board on which a predetermined pattern is provided, to form an adhesive layer on the board surface either in whole or in part;

(b) irradiating the photo-polymerizable adhesive with ultraviolet light to cause the adhesive to turn into a gel, thereby providing adhesiveness to the adhesive layer; and

(c) placing and pressing the electronic component correspondingly against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, wherein the photo-polymerizable adhesive is a delayed reactive adhesive,

wherein after the step (c), the method further comprises the step of

(d) irradiating at least the component mounting portion of the adhesive layer with ultraviolet light from obliquely above a corresponding electronic component to promote a curing reaction of the photo-polymerizable adhesive.

3. The method for manufacturing a circuit board on which an electronic component is mounted according to claim 2 , wherein, after the step (d), the entire adhesive layer is irradiated with ultraviolet light.

4. A method for manufacturing a circuit board on which an electronic component is mounted, comprising:

(a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a board surface including a component mounting portion of a printed board on which a predetermined pattern is provided, to form an adhesive layer on the board surface either in whole or in part;

(b) irradiating the photo-polymerizable adhesive with ultraviolet light to cause the adhesive to turn into a gel, thereby providing adhesiveness to the adhesive layer; and

(c) placing and pressing the electronic component correspondingly against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, wherein the photo-polymerizable adhesive is a delayed reactive adhesive,

wherein the photo-polymerizable adhesive supplied in the step (a) has a viscosity of 300 Pa·s or less measured on a cone-plate viscometer at a temperature of 25° C.

5. The method for manufacturing a circuit board on which an electronic component is mounted according to claim 1 , wherein the photo-polymerizable adhesive consists primarily of at least one resin selected from the group of a vinyl ether resin and an epoxy resin is used.