Three-dimensional circuit board and its manufacturing method
View Patent ↗A three-dimensional circuit board is formed by comprising a board, a first wiring-electrode group provided on a plurality of steps above the board, and a second wiring-electrode connected to the first wiring-electrode group at least in an altitude direction, in which at least a connecting portion between the first wiring-electrode group and the second wiring-electrode is integrated in a continuously identical shape.
1. A three-dimensional circuit board comprising:
a first wiring-electrode provided on a plurality of steps; and
a second wiring-electrode connected to the first wiring-electrode at least in an altitude direction,
wherein the first wiring-electrode and the second wiring-electrode are integrated continuously.
2. The three-dimensional circuit board of claim 1 , wherein a metal layer is provided on an outer surface of the first wiring-electrode and the second wiring-electrode.
3. The three-dimensional circuit board of claim 1 , wherein an insulating layer for burying the first wiring-electrode and the second wiring-electrode is provided at least up to a highest step of the first wiring-electrode.
4. The three-dimensional circuit board of claim 1 , further comprising a substrate board on which the first and second wiring-electrodes are disposed.
5. The three-dimensional circuit board of claim 3 , wherein an electronic component is mounted on at least one of the highest step and a lowest step of the first wiring-electrode.
6. The three-dimensional circuit board of claim 5 , wherein a dummy electrode is provided for holding a connection electrode the first wiring-electrode, in the connection electrode for connecting only between the electronic components the first wiring-electrode having at least one free end.
7. The three-dimensional circuit board of claim 1 , wherein the first wiring-electrode and the second wiring-electrode are provided at an arbitrary angle to a horizontal direction.