Multi-layer slip film for printing and lamination processes

1. A heat sealable, multi-layer film structure for multi-color printing or lamination processes, comprising:

(a) a core layer comprising a polypropylene homopolymer and essentially no migratory slip agents;

(b) a functional layer on a side of the core layer, wherein the functional layer is a printable layer or a laminatable layer consisting of ethylene-propylene copolymer or high density polyethylene; and

(c) a heat sealable skin layer consisting of a random ethylene-propylene copolymer on a side of the core layer opposite the functional layer, the heat sealable skin layer comprising the random ethylene-propylene copolymer and a slip system, wherein:

(i) the random ethylene-propylene copolymer comprises from 60 wt % to 80 wt % of propylene derived units, and

(ii) the slip system comprises from 0.05 to 0.5 wt % of an anti-block agent and:

(A) a silicone gum comprising less than or equal to 1500 ppmw of the sealant skin layer,

(B) a wax which comprises less than or equal to 7 wt % of the sealant skin layer, or

(C) a combination of the silicone gum and the wax, wherein the silicone gum comprises less than or equal to 1500 ppmw of the sealant skin layer and the wax comprises less than or equal to 10 wt % of the sealant skin layer;

wherein essentially none of the slip system is transferred to the functional layer during multi-layer film processing; adhesively laminated to a substrate with an adhesive layer, where the adhesive layer is disposed on a side of the functional layer opposite the core layer; and

wherein a bond between the functional layer and the adhesive layer has a bond strength of at least 50 g/in or more.

2. The heat sealable, multi-layer film structure of claim 1 , wherein the functional layer is:

(a) printed with 4 or more colorants using a multi-color print process (MCPP), or

(b) co-extruded with an adhesive layer on a side of the functional layer opposite the core layer, and the adhesive layer is laminated to a substrate.

3. The heat sealable, multi-layer film structure of claim 1 , wherein the heat sealable skin layer has a kinetic coefficient of friction of the sealant skin layer to itself of less than or equal to 0.30 measured in accordance to ASTM D1894 as described herein (using 200 g sled).

4. The heat sealable, multi-layer film structure of claim 1 , wherein the heat sealable skin layer has a minimum sealing temperature of the sealant skin layer to itself in a range from 185° F. to less than or equal to 240° F. (85 to 116° C.) measured in accordance to the MST test method described herein.

5. The heat sealable, multi-layer film structure of claim 1 , wherein the heat sealable skin layer has a force of less than or equal to 35 pounds over a packaging machine forming collar measured in accordance with FOFC test described herein.

6. The heat sealable multi-layer film structure of claim 1 , wherein the slip system consists essentially of silicone gum.

7. The heat sealable multi-layer film structure of claim 1 , wherein the slip system consists essentially of wax.

8. The heat sealable multi-layer film structure of claim 1 , wherein the slip system consists essentially of silicone gum and wax.

9. The heat sealable multi-layer film structure of claim 1 , wherein the functional layer or heat sealable skin layer is subjected to a flame treatment, a corona discharge treatment, a plasma treatment, a metallization process, a coating process or combinations thereof.

10. The heat sealable multi-layer film structure of claim 1 , further comprises a metal on the functional layer or heat sealable skin layer, wherein the metal is selected from the group consisting of aluminum, copper, silver, chromium, and mixtures thereof.