Method of manufacturing substrate, substrate manufacturing system, and method of manufacturing display

1. A method of manufacturing a substrate formed with a plurality of wiring patterns on a base, comprising:

a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns;

a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection,

a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and

a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.

2. The method of manufacturing a substrate according to claim 1 , wherein after the third inspection step is performed, a repair step for repairing the critical defect is included.

3. The method of manufacturing a substrate according to claim 2 , wherein after the third inspection step is performed, a repair procedure selection step for selecting a repair procedure based on at least a result of the third inspection step is included before the repair step is performed.

4. The method of manufacturing a substrate according to claim 3 , wherein in the repair procedure selection step, the repair procedure is selected based on the result of the third inspection step and lower layer wiring information of the pixel including the critical defect.

5. The method of manufacturing a substrate according to claim 3 , wherein in the repair procedure selection step, a disconnection procedure by laser irradiation and a connection procedure by laser CVD method or metal particle coating method are previously stored in a database, and at least one of the disconnection procedure and the connection procedure is selectively read from the database.

6. The method of manufacturing a substrate according to claim 5 , wherein in the repair procedure selection step, determination is made whether or not a lower wiring exists in the effective range of the critical defect, and at least the connection procedure is read from the database if the lower layer wiring exists.

7. A substrate manufacturing system for manufacturing a substrate formed with a plurality of wiring patterns on a base, comprising:

a first inspection section for identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns;

a second inspection section for examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection;

a matching section for matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection; and

a third inspection section for examining a relative position in a pixel and an effective range of the critical defect by an optical inspection.

8. The substrate manufacturing system according to claim 7 , wherein the third inspection section comprises:

an optical system for observing the critical defect;

a movement mechanism for relatively moving the optical system and the base; and

a repair mechanism for repairing the critical defect.

9. A method of manufacturing a display forming a display device on a substrate formed with a plurality of wiring patterns on a base, comprising:

a first inspection step of identifying a faulty wiring pattern having electric short circuit or disconnection by performing an electric inspection respectively for the plurality of wiring patterns;

a second inspection step of examining a relative position of a defect on the base and at least one of a type and a size of the defect by an optical inspection;

a matching step of matching a result of the first inspection step with a result of the second inspection step, and identifying a critical defect having electric short circuit or disconnection;

a third inspection step of examining a relative position in a pixel and an effective range of the critical defect by an optical inspection;

a repair step of repairing the critical defect after the third inspection step is performed; and

a display device formation step of forming the display device on the substrate with the critical defect repaired.