IP Library Granted Patent US 8,091,226
Granted Patent B2
US 8,091,226 · App. 12/100,646 · Granted Jan 10, 2012

Integrated header connector system

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Quick Facts
Patent No.
US 8,091,226
App. No.
12/100,646
Granted
Jan 10, 2012
Kind
B2
Abstract

Connector assemblies for use with implantable medical devices having easy to assemble contacts is disclosed. The connector assemblies are generally formed by coupling a plurality of contact rings, sealing rings, and spring contact elements together with at least one holding ring to form a connector having a common bore fore receiving a medical lead cable. Contact grooves for positioning the spring contact elements are formed in part by assembling multiple components together.

Claims (39)

1. A method of assembling a connector assembly for use with an implantable medical device comprising:

providing a header with a first header section and a second header section separated from one another along a lengthwise seam; the first header section and the second header section comprising a same number of grooves;

placing a conductive contact ring element with a spring contact element into a first groove;

placing a sealing ring into a second groove;

separating the contact ring from the sealing ring with a dividing wall; and

attaching a second header section to the first header section.

2. The method of claim 1 , further comprising placing a second conductive contact ring element into a third groove, which is spaced apart from the second groove and the first groove before attaching the second header section to the first header section.

3. The method of claim 2 , wherein the spring contact element is a radial canted coil spring.

4. The method of claim 3 , further comprising placing a second sealing ring into a fourth groove before attaching the second header section to the first header section.

5. The method of claim 1 , further comprising placing an assembly rod in through the conductive ring contact element before placing the conductive ring contact element into the first groove.

6. The method of claim 1 , wherein the dividing wall is singularly formed with the first header section.

7. The method claim 6 , wherein the second header section comprises a plurality singularly formed dividing walls.

8. A method is provided for assembling an implantable medical connector stack comprising selecting a first stack component for assembly;

dropping the first stack component into a first groove of a header section;

selecting a second stack component for assembly;

dropping the second stack component into a second groove of the header section; and

providing a dividing wall, formed of a material different from the first stack component and the second component, in between the first stack component and the second stack component to maintain the first stack component and the second stack component in a spaced apart relationship; and

wherein a spring contact element is located with the first stack component or the second stack component.

9. The method of claim 8 , further comprising dropping a holding ring into a groove of the header section.

10. The method of claim 8 , further comprising attaching a second header section to the header section.

11. The method of claim 10 , further comprising attaching the header section and the second header section to a sealed housing of an implantable medical device.

12. A method of assembling a connector assembly for use with an implantable medical device comprising:

providing a header with a first header section and a second header section; the first header section comprising a plurality of grooves;

placing a conductive contact ring element with a spring contact element into a first groove;

placing a sealing ring into a second groove;

separating the contact ring from the sealing ring with a dividing wall; and

attaching a second header section to the first header section;

wherein the first header section and the second header section define a lengthwise seam extending from a first end of the header to a second end of the header with a receiving bore for receiving a lead located at the first end or the second end.

13. The method of claim 12 , wherein the first header section and the second header section comprise a same number of grooves.

14. The method of claim 12 , further comprising placing a second conductive contact ring element into a third groove, which is spaced apart from the second groove and the first groove before attaching the second header section to the first header section.

15. The method of claim 14 , wherein the spring contact element is a radial canted coil spring.

16. The method of claim 15 , further comprising placing a second sealing ring into a fourth groove before attaching the second header section to the first header section.

17. The method of claim 12 , further comprising placing an assembly rod in through the conductive ring contact element before placing the conductive ring contact element into the first groove.

18. The method of claim 12 , wherein the dividing wall is singularly formed to the first header section and is made from a non-conductive material.

19. A method for forming a connector stack having reduced overall length comprising inserting a tubular ring into a groove of a header, said groove located between two seal ring elements, to form a ring groove; providing a spring in said tubular ring; and maintaining a space between said tubular ring and said two seal ring elements.

20. The method of claim 19 , wherein said tubular ring has a bottom wall and no side walls.

21. The method of claim 19 , further comprising placing a second tubular ring into a groove located adjacent one of the two seal ring elements.

22. The method of claim 21 , wherein the second tubular ring is separated from one of the two seal ring elements by a dividing wall.

23. The method of claim 19 , further comprising placing a holding ring into a groove.

Assignments (5)
SECURITY INTEREST Recorded Feb 27, 2025
From: X-MICROWAVE, LLC; TANTALUM PELLET COMPANY, LLC; EVANS CAPACITOR COMPANY, LLC; PACIFIC AEROSPACE & ELECTRONICS, LLC; OHIO ASSOCIATED ENTERPRISES, LLC; FILCONN, LLC; HERMETIC SOLUTIONS GROUP INC.; RUBBERCRAFT CORPORATION OF CALIFORNIA, LTD.; SWIFT TEXTILE METALIZING LLC; RMB PRODUCTS; BAL SEAL ENGINEERING, LLC; KAMATICS CORPORATION; BEI PRECISION SYSTEMS & SPACE COMPANY, INC.; PAKTRON LLC; OHMEGA TECHNOLOGIES, LLC; TICER TECHNOLOGIES, LLC; CUSTOM INTERCONNECTS, LLC; SANDERS INDUSTRIES HOLDINGS, INC.; AKROFIRE, LLC; KAMAN AEROSPACE CORPORATION; KAMAN CORPORATION
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 070344/0430 →
RELEASE OF INTELLECTUAL PROPERTY SECURITY AGREEMENTS (PATENTS) AT REEL 067175/FRAME 0740 Recorded Feb 27, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
Reel/Frame 070347/0014 →
RELEASE OF SECURITY INTEREST Recorded Apr 23, 2024
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC
Reel/Frame 067200/0800 →
IP SECURITY AGREEMENT Recorded Apr 22, 2024
From: KAMAN CORPORATION; KAMAN AEROSPACE CORPORATION; BAL SEAL ENGINEERING, LLC; AIRCRAFT WHEEL AND BRAKE, LLC; KAMATICS CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 067175/0740 →
AMENDED AND RESTATED PATENT COLLATERAL SECURITY AND PLEDGE AGREEMENT Recorded Sep 18, 2020
From: KAMATICS CORPORATION; BAL SEAL ENGINEERING, LLC
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 054304/0388 →