Printhead assembly with a thermosetting adhesive film for attaching printhead integrated circuitry
View Patent ↗The invention relates to a pagewidth printhead assembly. The assembly includes a molded polymer ink manifold defining a plurality of discrete fluid conduits therethrough. The assembly also includes a plurality of printhead integrated circuits (ICs) each having a plurality of micro-electromechanical nozzle arrangements for operatively ejecting printing fluid onto a printing medium. Each IC defines a plurality of discrete supply channels for supplying the nozzle arrangements with fluid, and has a bonding surface with a plurality of trenches etched therein, the trenches having a width of less than 10 microns to operatively attract a liquid adhesive by capillary action. The assembly also includes a thermosetting sealing film having a heat liquefied adhesive layer to adhere the bonding surface of the ICs to the lower member when said film is heated, so that the conduits and supply channels are in fluid communication with each other.
1. A pagewidth printhead assembly comprising:
a molded polymer ink manifold defining a plurality of discrete fluid conduits therethrough;
a plurality of printhead integrated circuits (ICs) each having a plurality of micro-electromechanical nozzle arrangements for operatively ejecting printing fluid onto a printing medium, each IC defining a plurality of discrete supply channels for supplying the nozzle arrangements with fluid, each IC having a bonding surface with a plurality of trenches etched therein, the trenches having a width of less than 10 microns to attract a liquid adhesive by capillary action; and
a thermosetting sealing film having a heat liquefied adhesive layer to adhere the bonding surface of the ICs to the ink manifold when said film is heated, so that the conduits and supply channels are in fluid communication with each other.
2. The printhead assembly of claim 1 , wherein the ink manifold includes an upper member and a lower member operatively joined to define the manifold having the fluid conduits therethrough.
3. The printhead assembly of claim 1 , wherein the sealing film has a plurality of laser-drilled holes defined therein to coincide with the supply channels defined in the ICs.
4. The printhead assembly of claim 1 , wherein the adhesive is operatively received in the plurality of etched trenches.
5. The printhead assembly of claim 1 , wherein a depth of an etched trench is at least 20 microns.
6. The printhead assembly of claim 1 , wherein a depth-to-width aspect ratio of the etched trenches is at least 3:1.
7. The printhead assembly of claim 2 , wherein the upper and lower members are injection moulded and are of a liquid crystal polymer (LCP).