TRANSMITTING DEVICE AND ELECTRONIC APPARATUS USING THE SAME

1 . A transmitting device comprising:

a main substrate;

an amplifier mounted on a top face of the main substrate;

a semiconductor integrated circuit (IC) mounted on a bottom face of the main substrate and coupled to the amplifier; and

a spacer substrate disposed on the bottom face of the main substrate,

wherein a height of the spacer substrate is larger than a height the semiconductor IC, and

the spacer substrate is disposed under the amplifier.

2 . The transmitting device of claim 1 , wherein the spacer substrate includes a first ground pattern disposed on one of a bottom face and an internal layer of the spacer substrate under the amplifier.

3 . The transmitting device of claim 2 , wherein the spacer substrate includes a first through-hole, which is electrically coupled to the first ground pattern, under the amplifier.

4 . The transmitting device of claim 1 , wherein the spacer substrate includes a second ground pattern, which is disposed on a top face of the spacer substrate, under the amplifier.

5 . The transmitting device of claim 3 , wherein the main substrate includes a third ground pattern, which is disposed on the bottom face of the main substrate, under the amplifier, and the third ground pattern is in electrical continuity with the first ground pattern disposed on a bottom face of the spacer substrate.

6 . The transmitting device of claim 1 , wherein the main substrate includes a fourth ground pattern, which is disposed on the top face of the main substrate, under the amplifier disposed on the top face of the main substrate.

7 . The transmitting device of claim 2 , further comprising:

a semiconductor switch disposed on the top face of the main substrate and coupled to the amplifier,

wherein the spacer substrate is disposed under the semiconductor switch, and

the spacer substrate includes a fifth ground pattern disposed on one of a bottom face and an internal layer of the spacer substrate under the semiconductor switch.

8 . The transmitting device of claim 7 , wherein the first ground pattern and the fifth ground pattern are disposed on the spacer substrate so as to be electrically insulated from each other.

9 . The transmitting device of claim 7 , wherein the spacer substrate includes a second through-hole, which is electrically coupled to the fifth ground pattern, under the semiconductor switch.

10 . The transmitting device of claim 7 , wherein the spacer substrate includes a sixth ground pattern, which is disposed on a top face of the spacer substrate, under the semiconductor switch.

11 . The transmitting device of claim 7 , wherein

the main substrate includes a seventh ground pattern, which is disposed on the bottom face of the main substrate, under the semiconductor switch, and

the seventh ground pattern is in electrical continuity with the fifth ground pattern disposed on the bottom face of the spacer substrate.

12 . The transmitting device of claim 7 , wherein the main substrate includes an eighth ground pattern, which is disposed under the semiconductor switch disposed on the top face of the main substrate, on the top face of the main substrate.

13 . The transmitting device of claim 3 , wherein

the main substrate includes a primary through-hole under the amplifier, and

a diameter of the first through-hole is larger than a diameter of the primary through-hole.

14 . The transmitting device of claim 9 , wherein

the main substrate includes a secondary through-hole under the semiconductor switch, and

a diameter of the second through-hole is larger than a diameter of the secondary through-hole.

15 . The transmitting device of claim 6 , wherein

the spacer substrate includes:

a first ground pattern, which is disposed on one of a bottom face and an internal layer of the spacer substrate, under the amplifier; and

a second ground pattern, which is disposed on a top face of the spacer substrate, under the amplifier, and

an area of at least one of the first ground pattern and the second ground pattern is larger than an area of the fourth ground pattern.

16 . The transmitting device of claim 12 , wherein

the spacer substrate includes:

the fifth ground pattern, which is disposed on one of the bottom face and the internal layer of the spacer substrate, under the semiconductor switch; and

a sixth ground pattern, which is disposed on a top face of the spacer substrate, under the semiconductor switch, and

an area of at least one of the fifth ground pattern and the sixth ground pattern is larger than an area of the eighth ground pattern.

17 . The transmitting device of claim 1 , further comprising:

a radio-frequency (RF) semiconductor circuit disposed on the top face of the main substrate; and

an oscillating circuit coupled to the RF semiconductor circuit,

wherein the amplifier and the oscillating circuit are disposed on an identical surface or different surfaces of the main substrate in positions diagonal to each other.

18 . The transmitting device of claim 17 , further comprising:

a filter for suppressing an unnecessary signal and a low-noise amplifier that are coupled between the semiconductor switch and the RF semiconductor circuit,

wherein the RF semiconductor circuit has both transmitting function and receiving function.

19 . A transmitting device comprising:

a main substrate having a rectangular shape;

an amplifier mounted on a top face of the main substrate;

a semiconductor integrated circuit (IC) mounted on a bottom face of the main substrate and coupled to the amplifier; and

a spacer substrate having a rectangular frame shape and disposed on the bottom face of the main substrate so as to surround the semiconductor IC,

wherein a height of the spacer substrate is larger than a height of the semiconductor IC,

at least one of four sides of the spacer substrate is wider than other sides, and

the amplifier is disposed above the wider side of the spacer substrate.

20 . An electronic apparatus comprising:

the transmitting device of claim 1 .

21 . An electronic apparatus comprising:

a double-sided mounting substrate including an exothermic circuit element mounted on a top face thereof;

a spacer substrate that has a height larger than a maximum height of circuit elements to be mounted on a bottom face of the double-sided mounting substrate; and

a motherboard closely contacted with the spacer substrate,

wherein the spacer substrate is closely contacted with the bottom face of the double-sided mounting substrate,

the spacer substrate includes an opening space in a position corresponding to the circuit elements to be mounted on the bottom face of the double-sided mounting substrate, and

a portion corresponding to a bottom face of the exothermic circuit element is closely contacted with the spacer substrate.