Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
1. A method of forming a bond, the method comprising the steps of:
(1) providing a flexible conductive ribbon on a conductive surface; and
(2) ultrasonically bonding the flexible conductive ribbon onto the conductive surface using a ribbon bonding tool to form a bond between the flexible conductive ribbon and the conductive surface,
wherein step (2) includes forming the bond to have a first bonded portion and a second bonded portion proximate the first bonded portion, the first bonded portion being thicker than the second bonded portion and thinner than an unbonded portion of the flexible conductive ribbon proximate the bond, and wherein a bond strength of the second bonded portion is greater than a bond strength of the first bonded portion.
2. The method of claim 1 , wherein step (2) includes ultrasonically bonding only an interior portion of a width of the flexible conductive ribbon to form the bond, the portion bond being circular shaped.
3. The method of claim 1 , wherein step (2) includes ultrasonically bonding only an interior portion of a width of the flexible conductive ribbon to form the bond, the portion bond being square shaped.
4. The method of claim 1 , wherein the flexible conductive ribbon has a width greater than 2 mm.
5. The method of claim 1 , wherein step (2) includes ultrasonically bonding only an interior portion of the flexible conductive ribbon to form the bond.
6. The method of claim 1 , wherein the ribbon bonding tool includes a bond foot at an end thereof, the bond foot including a plurality of teeth, and wherein step (2) includes forming the second bonded portion through contact between a portion of the flexible conductive ribbon and a lower surface of the plurality of teeth.
7. The method of claim 1 , wherein the ribbon bonding tool includes a bond foot at an end thereof, the bond foot including a plurality of teeth and a plurality of grooves between the plurality of teeth, and wherein step (2) includes forming the first bonded portion through contact between a portion of the flexible conductive ribbon and a bottom portion of the plurality of grooves.
8. The method of claim 1 , wherein step (2) includes ultrasonically bonding only an interior portion of the flexible conductive ribbon to form the bond, the bond being waffle shaped.
9. The method of claim 1 , wherein the second bonded portion includes a plurality of circular shaped recesses.
10. The method of claim 1 , wherein the ribbon bonding tool includes a bond foot at an end thereof, the bond foot including a plurality of teeth having a tapered shape along a length extending from a surface of the bond foot to an end of each of the plurality of teeth.
11. The method of claim 1 , wherein a thickness of the flexible conductive ribbon material at the second bonded portion is less than 100 μm.
12. The method of claim 1 , wherein the ribbon bonding tool includes a bond foot at an end thereof, the bond foot including a plurality of teeth and a plurality of grooves between the plurality of teeth, and wherein the plurality of grooves having a depth d groove of at least 100 μm.
13. The method of claim 1 , wherein the ribbon bonding tool includes a bond foot at an end thereof, the bond foot including a plurality of teeth and a plurality of grooves between the plurality of teeth, and wherein the plurality of grooves having a depth d groove , wherein during step (2) the ribbon bonding tool is depressed into the flexible conductive ribbon to a depth that exceeds the depth d groove .
14. The method of claim 1 , wherein ultrasonic power and bond force are imparted to the flexible conductive ribbon by the bonding tool during step (2).
15. The method of claim 1 , wherein the flexible conductive ribbon has a rectangular cross-section.