Electromagnetic wave-absorption multilayer substrate
View Patent ↗An electromagnetic wave-absorption multilayer substrate has an electromagnetic wave-absorption sheet which includes a soft magnetic alloy powder and a binding agent and two insulating substrates which have facing surfaces facing the electromagnetic wave-absorption sheet and which are pressure-bonded thereto. In addition, one of the insulating substrates has a plurality of holes formed in the facing surface.
1. An electromagnetic wave-absorption multilayer substrate comprising:
an electromagnetic wave-absorption sheet which includes a soft magnetic alloy powder and a binding agent and which has a sheet shape; and
two insulating substrates which have facing surfaces facing the electromagnetic wave-absorption sheet and which sandwich the electromagnetic wave-absorption sheet and are pressure-bonded thereto,
wherein at least one of the two insulating substrates has at least one hole formed in the facing surface or at least one protrusion formed on the facing surface such that a portion of the electromagnetic wave-absorption sheet corresponding to the hole or corresponding to non-protrusion is not or less compressed by the insulating substrates compared to other portions of the electromagnetic wave-absorption sheet between the insulating substrates when the insulating substrates are pressure-bonded,
and wherein said at least one hole has a depth less than a thickness of the insulating substrate and does not penetrate the insulating substrate.
2. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the number of the holes or the protrusions is at least two.
3. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the holes or the protrusions are disposed at regular intervals.
4. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the hole or the protrusion has a rectangular shape or a linear wall shape.
5. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the holes or the protrusions are disposed in a lattice shape or a staggered lattice shape.
6. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the insulating substrates are formed of prepregs and are thermal pressure-bonded to the electromagnetic wave-absorption sheet.
7. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the hole or the protrusion is formed by press machining.
8. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the soft magnetic alloy powder comprises a metal glass alloy containing an amorphous phase as a primary phase.
9. The electromagnetic wave-absorption multilayer substrate according to claim 1 , wherein the hole or the protrusion has a hole depth or a protrusion length of 25 to 440 μm.