Building slab, floor panels in particular, and method of manufacturing the same
View Patent ↗A building board, in particular a flooring panel, with a core comprising at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another, which is provided on at least its top side with a pattern that is covered with a sealing coat and in which sealing coat a structure corresponding to the pattern is embossed, is characterized in that at least the chips of the upper layer are glued with an adhesive having thermoplastic properties, and the upper layer has recesses formed at least directly beneath the pattern.
1. A building board with a core comprising:
at least one upper layer and one lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another; and
a printed pattern provided on a top side of the core that is covered with a sealing coat, wherein
the sealing coat includes an embossed surface structure corresponding to the printed Pattern,
the adhesive of at least the upper layer includes thermoplastic properties, and
the upper layer of the core includes the embossed surface structure matched with the printed pattern.
2. The building board according to claim 1 , wherein a composition of the adhesive for the upper layer is different from a composition of the adhesive for the lower layer.
3. The building board according to claim 2 , wherein the adhesive for the upper layer has higher thermoplastic properties than the adhesive for the lower layer.
4. The building board according to claim 1 , wherein the adhesive for the upper layer contains alone or in any desired combination at least one of:
a PF-novolak;
an acrylate dispersion;
an ethylene vinyl acetate dispersion (EVA);
apolyvinyl acetate dispersion (PVAc);
a polyvinyl alcohol (PVA); and
a silane-based system.
5. The building board according to claim 1 , wherein a thickness of the upper layer is approximately one third of a thickness of the core.
6. The building board according to claim 5 , wherein the upper layer is a postformable upper layer.
7. The building board according to claim 1 , wherein the surface structure has at least in part a depth of at least 500 μm.
8. The building board according to claim 1 , wherein the printed pattern is embodied as a printed paper ply.
9. The building board according to claim 1 , wherein the printed pattern is embodied as at least one paint coat printed directly onto the core.
10. The building board according to claim 1 , wherein the sealing coat comprises at least one varnish layer hardenable by UV or electron beams.
11. The building board according to claim 1 , wherein the sealing coat comprises at least one resin layer, on a basis of UF, MF, MUF.
12. The building board according to claim 11 , further comprising abrasion-resistant particles added to the sealing coat.
13. The building board according to claim 1 , wherein the sealing coat is embodied as a resin-impregnated overlay.
14. The building board according to claim 1 , further comprising a counteracting layer applied to an underside of the core.
15. The building board according to claim 14 , wherein the counteracting layer is embodied as a resin-impregnated paper ply.
16. The building board according to claim 14 , wherein the counteracting layer is embodied as a directly applied varnish layer or resin layer.
17. A building board comprising:
an upper layer and a lower layer of wood fibers or wood chips glued with an adhesive and pressed to one another by an adhesive, the adhesive for the upper layer having thermoplastic properties, which are different than properties of the adhesive for the lower layer;
a printed pattern provided on a top side of the upper layer that is covered with a sealing coat having an embossed surface structure corresponding to the printed pattern, wherein
the upper layer includes the embossed surface structure formed to match the printed pattern.