Semiconductor packaging with internal wiring bus
View Patent ↗A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.
1. A semiconductor package comprising:
a die pad;
an interposer mounted on the die pad, the interposer having a ground connection and a power connection;
a first semiconductor die mounted on the die pad, wherein the first semiconductor die is positioned side-by-side to the interposer;
a second semiconductor die mounted on the interposer;
wiring that directly couples the first semiconductor die to (i) bond fingers, (ii) the ground connection, and (ii) the power connection; and
wiring that directly couples the second semiconductor die to (i) bond fingers, (ii) the ground connection, and (iii) the power connection.
2. The semiconductor package of claim 1 , further comprising:
a third semiconductor die mounted on the first semiconductor die.
3. The semiconductor package of claim 2 , further comprising:
wiring that directly couples the third semiconductor die to (i) bond fingers and (ii) the first semiconductor die.
4. The semiconductor package of claim 2 , further comprising:
a fourth semiconductor die mounted on the second semiconductor die.
5. The semiconductor package of claim 4 , further comprising:
wiring that directly couples the fourth semiconductor die to (i) bond fingers and (ii) the second semiconductor die,
wherein the wiring that directly couples the fourth semiconductor die to the second semiconductor die is further electrically coupled to (i) the ground connection, and (ii) the power connection through the wiring that directly couples the second semiconductor die to the ground connection and the power connection.
6. The semiconductor package of claim 1 , wherein the ground connection and the power connection are disposed between (i) the first semiconductor die and (ii) the second semiconductor die.
7. The semiconductor package of claim 1 , wherein:
the ground connection is a first ground connection and the power connection is a first power connection, the interposer further comprising (i) a second ground connection and (ii) a second power connection;
the second ground connection is wire bonded to an electrical ground;
the second power connection is wire bonded to bond fingers;
the first ground connection is electrically coupled to the second ground connection to provide indirect access to the electrical ground for the first semiconductor die and the second semiconductor die; and
the first power connection is electrically coupled to the second power connection to provide indirect access to bond fingers for the first semiconductor die and the second semiconductor die.
8. The semiconductor package of claim 7 , wherein:
the first ground connection is routed inside the interposer to the second ground connection; and
the first power connection is routed inside the interposer to the second power connection.
9. The semiconductor package of claim 7 , wherein:
the first ground connection and the first power connection are disposed between respective inner, opposing edges of the first semiconductor die and the second semiconductor die; and
the second ground connection and the second power connection are disposed along an edge of the interposer that is substantially perpendicular to the inner, opposing edges of the first semiconductor die and the second semiconductor die.
10. The semiconductor package of claim 7 , wherein the electrical ground comprises a ring-shaped structure that surrounds the first semiconductor die and the interposer.
11. The semiconductor package of claim 1 , wherein the interposer functions as a capacitor or an inductor.
12. The semiconductor package of claim 1 , wherein the interposer comprises at least one of (i) a ball-grid array (BGA) substrate material and (ii) a silicon die.
13. The semiconductor package of claim 1 , wherein the die pad is exposed to provide thermal regulation.
14. The semiconductor package of claim 1 , further comprising:
wiring that directly couples the first semiconductor die to the second semiconductor die.
15. The semiconductor package of claim 4 , wherein:
the first semiconductor die comprises an application specific integrated circuit (ASIC);
the second semiconductor die comprises random access memory;
the third semiconductor die comprises flash memory; and
the fourth semiconductor die comprises another random access memory.