IP Library Granted Patent US 8,235,560
Granted Patent B2
US 8,235,560 · App. 12/106,458 · Granted Aug 7, 2012

Backlight module

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Quick Facts
Patent No.
US 8,235,560
App. No.
12/106,458
Granted
Aug 7, 2012
Kind
B2
Abstract

A backlight module includes a panel, a base, at least a light-emitting element, a heat-dissipating board and at least a circuit board. The base is connected to the panel to form an accommodating space. The light-emitting element is disposed in the accommodating space. The heat-dissipating board is disposed on the base and connected to the base. The heat-dissipating board includes at least two connecting portions and a top portion. The connecting portions are respectively connected to two ends of the top portion and the base to separate the top portion from the base for forming a heat-dissipating space therebetween. The circuit board is disposed on an outer surface of the top portion far away from the base.

Claims (16)

1. A backlight module, comprising:

a panel;

a base, connected to the panel to form an accommodating space, wherein the base has a sheet part;

at least one light-emitting element, installed in the accommodating space;

a heat-dissipating board, disposed on the base and connected to the base, comprising at least two connecting portions and a top portion, wherein the connecting portions are respectively connected to two ends of the top portion and the base to separate the base from the top portion and to form a heat-dissipating space; and

at least one circuit board, disposed on an outer surface of the top portion far away from the base, wherein the base, the heat-dissipating board, and the heat-dissipating space are located between the at least one circuit board and the at least one light-emitting element, wherein a surface of the at least one circuit board is not exposed to the heat-dissipating space, wherein there is a space between the top portion and the at least one circuit board, wherein the base separates the at least one light-emitting element from the at least one circuit board, and wherein the at least one light-emitting element and the at least one circuit board are respectively located on opposite sides of the base.

2. The backlight module as claimed in claim 1 , wherein the heat-dissipating board is U-shaped.

3. The backlight module as claimed in claim 1 , wherein the connecting portions of the heat-dissipating board are separated by an interval, two opposite sides of the base are separated by a length, the length and the interval face the same direction, and the interval is equal to the length.

4. The backlight module as claimed in claim 1 , wherein the connecting portions of the heat-dissipating board are separated by an interval, two opposite sides of the base are separated by a length, the length and the interval face the same direction, and the interval is less than the length.

5. The backlight module as claimed in claim 1 , wherein the connecting portions of the heat-dissipating board are separated by an interval, two opposite sides of the base are separated by a length, the length and the interval face the same direction, and the interval is greater than the length.

6. The backlight module claimed in claim 1 , further comprising a heat-dissipating element installed between the base and the heat-dissipating board.

7. The backlight module claimed in claim 6 , wherein the heat-dissipating element comprises a heat sink, and the heat sink comprises a plate installed on the base and a plurality of sheets connected to the plate.

8. The backlight module claimed in claim 7 , wherein the plate and the heat-dissipating board are separated by a thickness T, two opposite sides of the base are separated by a length L 1 , the length L 1 and the arrangement of the sheets face the same direction, and T>0.014L 1 .

9. The backlight module claimed in claim 7 , wherein the two adjacent sheets are separated by a width W, two opposite sides of the base are separated by a length L 1 , the length L 1 and the arrangement of the sheets face the same direction, and W>0.014L 1 .

10. The backlight module claimed in claim 1 , further comprising a fan disposed on the outer surface of the top portion of the heat-dissipating board, wherein the fan comprises an outlet toward the heat-dissipating space to guide an airflow to the heat-dissipating space.

11. The backlight module claimed in claim 1 , wherein the heat-dissipating space is an empty space.

Assignments (3)
MERGER Recorded Jan 9, 2019
From: YOUNG LIGHTING TECHNOLOGY INC.
To: CORETRONIC CORPORATION
Reel/Frame 048039/0223 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 020831 FRAME 0507. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jun 27, 2012
From: PAN, BOR-JYH; LIN, YI-WEN
To: YOUNG LIGHTINING TECHNOLOGY INC.
Reel/Frame 028456/0751 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2008
From: PAN, BOR-JYH; LIN, YI-WEN
To: YOUNG LIGHTING TECHNOLOGY CORPORATION
Reel/Frame 020831/0507 →