Conducting radio frequency signals using multiple layers
View Patent ↗The present disclosure includes a system and method for conducting radio frequency signals using multiple layers. In some implementations, a signal transfer element configured to passively transfer RF signals between a first region and a second region includes a first conductor layer having a first continuous conductor configured as a first portion of a first antenna, a transmission line, and a first portion of a second antenna. The first antenna and the second antenna are configured to wirelessly receive and transmit Radio Frequency (RF) signals. The signal transfer element also includes a second conductor layer having a second continuous conductor configured as a second portion of the first antenna, a ground plane, and a second portion of the second antenna. The first conductor layer and the second conductor layer are spatially proximate such that the transmission line and the ground plane are configured to passively transfer RF signals between the first antenna and the second antenna independent of an electrical connection between the first conductor layer and the second conductor layer.
1. A signal transfer element configured to passively transfer RF signals between a first region and a second region, comprising:
a first conductor layer including a first continuous conductor configured as a first portion of a first antenna, a transmission line, and a first portion of a second antenna, wherein the first antenna and the second antenna are configured to wirelessly receive and transmit Radio Frequency (RF) signals; and
a second conductor layer including a second continuous conductor configured as a second portion of the first antenna, a ground plane, and a second portion of the second antenna, wherein the first conductor layer and the second conductor layer are spatially proximate such that the transmission line and the ground plane are configured to passively transfer RF signals between the first antenna and the second antenna independent of an electrical connection between the first conductor layer and the second conductor layer.
2. The signal transfer element of claim 1 , wherein the first portion of the first antenna comprises a first leg of the first antenna, the second portion of the first antenna comprises a second leg of the first antenna, the first portion of the second antenna comprises a first leg of the second antenna, the second portion of the second antenna comprises a second leg of the second antenna.
3. The signal transfer element of claim 1 , wherein the first continuous conductor and the second continuous conductor comprise at least one of a copper alloy or a silver alloy.
4. The signal transfer element of claim 1 , wherein the first continuous conductor and the second continuous conductor comprise at least one of a microstrip or a stripline.
5. The signal transfer element of claim 1 , wherein the first conductor layer and the second conductor layer are substantially parallel.
6. The signal transfer element of claim 1 , wherein the first conductor layer and the second conductor layer are separated by a distance of 20 mils or less.
7. The signal transfer element of claim 1 , where an insulating layer forms the distances between the first conductor layer and the second conductor layer.
8. The signal transfer element of claim 1 , wherein the ground plane comprises a first group plane, further comprising a second ground plane and a third ground plane spatially proximate the transmission line.
9. The signal transfer element of claim 1 , wherein the first conductor layer and the second conductor layer are affixed to form the signal transfer element.
10. The signal transfer element of claim 1 , wherein the transmission line is 2 feet or greater.
11. The signal transfer element of claim 1 , wherein the signal transfer element is at least affixed to a surface of a container.
12. The signal transfer element of claim 1 , wherein the RF signals passively transferred between the first antenna and the second antenna are in a frequency range from 125 KHz to 2.5 GHz.
13. The signal transfer element of claim 1 , further comprising:
an RFID chip electrically coupled with the first antenna; and
conductors connected to the RFID chip and at least spatially proximate the first antenna, wherein RF signals are passively transferred between the first antenna and the RFID chip using the conductors.
14. The signal transfer element of claim 13 , wherein the conductors are connected to the first antenna.
15. The signal transfer element of claim 13 , wherein the conductors are capacitively coupled to the first antenna.
16. The signal transfer element of claim 15 , further comprising a dielectric layer is selectively positioned between the first antenna and the conductors.
17. The signal transfer element of claim 16 , wherein the dielectric layer is 20 mils or less.
18. The signal transfer element of claim 13 , further comprising a protective layer adjacent the RFID chip and the conductors.