Method of making a device for measuring deformation
View Patent ↗A method of making a device for measuring deformation includes a step of depositing a silicon adhesion underlayer on a silicon carbide surface by chemical vapor spraying, and a step of depositing a coating on the silicon adhesion underlayer by atmospheric thermal spraying.
1. A method of making a device for measuring deformation, the method comprising the following steps:
a) depositing, on a silicon carbide surface of a part constituted by a substrate covered in a silicon carbide layer deposited by chemical vapor deposition, a silicon adhesion underlayer by vacuum plasma spraying;
b) depositing on said silicon adhesion underlayer an alumina coating by atmospheric thermal spraying;
c) placing a free filament strain gauge on said coating, the gauge being held on a support, and said support possessing openings;
d) depositing a second alumina coating on said strain gauge and on said coating by atmospheric thermal spraying through said openings;
e) removing said support; and
f) depositing a third alumina coating by atmospheric thermal spraying on said first coating, on said second coating, and on said strain gauge.
2. The method according to claim 1 , wherein the adhesion underlayer has a thickness of 50 μm to 70 μm.
3. The method according to claim 1 , wherein the atmospheric thermal spraying is selected between plasma spraying and flame spraying.
4. The method according to claim 1 , wherein said substrate is selected between a composite material having a silicon carbide matrix and a composite material having a self-healing ceramic matrix.