IP Library Patent Application 12109762
Patent Application
App. No. 12/109,762

Light-Emitting Diode Package

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Quick Facts
Patent No.
US None
App. No.
12/109,762
Abstract

A light-emitting diode (LED) package includes a holder. In one implementation, first and second light-emitting chips associated with different wavelengths but same color are disposed on the holder. In another implementation, first and second light-emitting chips associated with different brightnesses but same chroma are disposed on the holder. In yet another implementation, a plurality of first, second, and third color light-emitting chips are disposed symmetrically about a center of the holder.

Claims (50)

1 . A light-emitting diode (LED) package, comprising:

a holder; and

first and second light-emitting chips, disposed on the holder, and associated with different wavelength ranges but a same color.

2 . The LED package as claimed in claim 1 , wherein the holder has a center, and the first and the second light-emitting chips are symmetrically arranged on the holder about the center.

3 . The LED package as claimed in claim 1 , wherein the holder has a recess, and the first and the second light-emitting chips are disposed in the recess.

4 . The LED package as claimed in claim 1 , wherein the holder is a package substrate.

5 . A backlight module, comprising:

a frame;

a light source, disposed in the frame, comprising:

a holder, disposed on the frame; and

first and second light-emitting chips, disposed on the holder, and associated with different wavelength ranges but a same color.

6 . The backlight module as claimed in claim 5 , wherein the holder has a center, and the first and the second light-emitting chips are symmetrically arranged on the holder about the center.

7 . The backlight module as claimed in claim 5 , further comprising a light guide plate disposed in the frame, wherein the light guide plate has a light incident side, and the light source is located adjacent the light incident side.

8 . The backlight module as claimed in claim 5 , further comprising a diffusion plate disposed on the frame, wherein the light source is located between the diffusion plate and the frame.

9 . The backlight module as claimed in claim 5 , further comprising an optical film disposed on the frame.

10 . The backlight module as claimed in claim 9 , wherein the optical film comprises a diffusion film, a brightness enhancement film, or a prism film.

11 . A liquid crystal display (LCD) device, comprising:

the backlight module according to claim 5 ; and

an LCD panel disposed on the backlight module.

12 . A light-emitting diode (LED) package, comprising:

a holder; and

first and second light-emitting chips, disposed on the holder, and associated with different brightnesses but a same chroma.

13 . The LED package as claimed in claim 12 , wherein the holder has a center, and the first and the second light-emitting chips are symmetrically arranged on the holder about the center.

14 . The LED package as claimed in claim 12 , wherein the holder has a recess, and the first and the second light-emitting chips are disposed in the recess.

15 . A backlight module, comprising:

a frame;

a light source, disposed in the frame, comprising:

a holder, disposed on the frame; and

first and second light-emitting chips, disposed on the holder, and associated with different brightnesses but a same chroma.

16 . The backlight module as claimed in claim 15 , further comprising a light guide plate disposed in the frame, wherein the light guide plate has a light incident side, and the light source is located adjacent the light incident side.

17 . The backlight module as claimed in claim 15 , further comprising a diffusion plate disposed on the frame, wherein the light source is located between the diffusion plate and the frame.

18 . The backlight module as claimed in claim 15 , further comprising an optical film disposed on the frame.

19 . A liquid crystal display (LCD) device, comprising:

the backlight module according to claim 16 ; and

an LCD panel disposed on the backlight module.

20 . A light-emitting diode (LED) package, comprising:

a holder having a center; and

a plurality of first, second, and third color light-emitting chips, symmetrically arranged about the center.

21 . The LED package as claimed in claim 20 , wherein the holder has a recess, and the center is in the recess, and the first, the second, and the third color chips are all disposed in the recess.

22 . The LED package as claimed in claim 20 , wherein the first, the second, and the third colors are red, green, and blue, respectively.

23 . A backlight module, comprising:

a frame;

a light source, disposed in the frame, comprising:

a holder, disposed on the frame, and having a center; and

first color light-emitting chips symmetrically arranged about the center;

second color light-emitting chips symmetrically arranged about the center; and

third color light-emitting chips symmetrically arranged about the center.

24 . A liquid crystal display (LCD) device, comprising:

a backlight module according to claim 24 ; and

an LCD panel disposed on the backlight module.

Assignments (3)
CHANGE OF NAME Recorded Apr 13, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032672/0813 →
MERGER Recorded May 12, 2010
From: CHI MEI OPTOELECTRONICS CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 024369/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2008
From: HSU, YING-HAO; PAI, WEI-MING
To: CHI MEI OPTOELECTRONICS CORP.
Reel/Frame 020857/0414 →