IP Library Granted Patent US 8,161,627
Granted Patent B2
US 8,161,627 · App. 12/110,705 · Granted Apr 24, 2012

Method of making a write head lapping guide about aligned to a non-magnetic layer surrounding a write pole

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Quick Facts
Patent No.
US 8,161,627
App. No.
12/110,705
Granted
Apr 24, 2012
Kind
B2
Abstract

A method in one embodiment includes forming an electric lapping guide layer; forming a write pole; forming a first gap layer over the write pole; masking a portion of the first gap layer for defining a window over the write pole and at least a portion of the electric lapping guide layer; and forming a bump over the write pole in the window. Additional methods and systems are presented.

Claims (32)

1. A method, comprising:

forming an electric lapping guide layer;

forming a write pole;

forming a first gap layer over the write pole;

masking a portion of the first gap layer for defining a window over the write pole and at least a portion of the electric lapping guide layer; and

forming a bump over the write pole in the window.

2. The method as recited in claim 1 , wherein only a portion of the electric lapping guide layer is masked, and further comprising removing an exposed portion of the electric lapping guide layer.

3. The method as recited in claim 2 , wherein the exposed portion of the electric lapping guide layer is removed by etching.

4. The method as recited in claim 1 , wherein the electronic lapping guide layer and the bump are about coplanar.

5. The method as recited in claim 1 , wherein the electronic lapping guide layer and the write pole are about coplanar.

6. The method as recited in claim 1 , wherein a back end of the electric lapping guide layer and a front end of the bump are about a same distance from an expected lapped surface of the write pole.

7. The method as recited in claim 1 , wherein the electric lapping guide layer and the bump have different compositions.

8. The method as recited in claim 1 , wherein the bump is plated.

9. The method as recited in claim 1 , further comprising forming a second gap layer, two portions of the second gap layer being in electrical communication with the electric lapping guide layer.

10. The method as recited in claim 9 , further comprising adding a wrap around shield layer above the write pole and the two portions of the second gap layer that are in electrical communication with the electric lapping guide layer.

11. The method as recited in claim 10 , further comprising removing exposed portions of the second gap layer.

12. The method as recited in claim 11 , further comprising forming electrical contacts above the wrap around shield layer formed above the two portions of the second gap layer, the electrical contacts being in electrical communication with the electric lapping guide layer.

13. A method, comprising:

forming an electric lapping guide layer;

forming a write pole;

forming a first gap layer over the write pole, the first gap layer not covering the electric lapping guide layer;

masking a portion of the electric lapping guide layer, and a portion of the first gap layer for defining a window over the write pole;

removing an exposed portion of the electric lapping guide layer; and

forming a bump over the write pole in the window, wherein a back end of the electric lapping guide layer and a front end of the bump are about a same distance from an expected lapped surface of a head.

14. The method as recited in claim 13 , wherein the exposed portion of the electric lapping guide layer is removed by etching.

15. The method as recited in claim 13 , wherein the electronic lapping guide layer and the bump are about coplanar.

16. The method as recited in claim 13 , wherein the electronic lapping guide layer and the write pole are about coplanar.

17. The method as recited in claim 13 , wherein the electric lapping guide layer and the bump have different compositions.

18. The method as recited in claim 13 , wherein the bump is plated.

19. The method as recited in claim 13 , further comprising forming a second gap layer having at least two portions, two of the portions of the second gap layer being in electrical communication with the electric lapping guide layer.

20. The method as recited in claim 19 , further comprising adding a wrap around shield layer above the write pole and the two portions of the second gap layer that are in electrical communication with the electric lapping guide layer.

21. The method as recited in claim 20 , further comprising removing exposed portions of the second gap layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2016
From: HGST NETHERLANDS B.V.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 040826/0821 →
CHANGE OF NAME Recorded Oct 25, 2012
From: HITACHI GLOBAL STORAGE TECHNOLOGIES NETHERLANDS B.V.
To: HGST NETHERLANDS B.V.
Reel/Frame 029341/0777 →