Multi-channel filter assemblies
View Patent ↗A filter assembly includes an electrically conductive input member, an electrically conductive output member, and filter elements. Each filter element includes a connection disposed in an open or closed configuration, and a band filter, which may be a band-pass filter or a band-stop filter. A generic filter assembly is first manufactured having all connections in their open or closed configurations. A channel-selective filter assembly is then further manufactured by structural modification of one or more of the connections. Each connection of the channel-selective filter assembly is in its open or closed configuration independently of each other connection of each other filter element. Each frequency channel in a cable television (CATV) network, for example, is restricted or permitted by the channel-selective filter assembly.
1. A method of making a filter assembly, the method comprising:
disposing an electrically conductive input member on a substrate;
disposing an electrically conductive output member on the substrate;
disposing a plurality of band filters on the substrate, wherein each band filter is structured to pass or stop oscillatory electrical signals in a respective frequency band;
disposing a plurality of connections on the substrate in one-to-one correspondence with the band filters, wherein the connections are structured such that every connection is disposed in an electrically non-conductive open configuration or such that every connection is disposed in an electrically conductive closed configuration; and
structurally modifying at least one of the connections from the electrically open configuration to the electrically closed configuration or from the electrically closed configuration to the electrically open configuration,
wherein, at least upon structurally modifying at least one of the connections, a transmission path for oscillatory electrical signals is defined between the input member and the output member, through which transmission path oscillatory electrical signals in at least one said frequency band is attenuated or blocked from passing from the input member to the output member.
2. The method of claim 1 , wherein structurally modifying at least one of the connections comprises disposing an electrical jumper across a gap defined by a particular connection such that, by disposing the electrical jumper, the particular connection is structurally modified from the electrically open configuration to the electrically closed configuration.
3. The method of claim 2 , wherein disposing an electrical jumper across a gap comprises disposing electrically conductive material across the gap by at least one of chemical vapor deposition, sputtering, epitaxial growth, solder reflowing, and placement of an electrically conductive member.
4. The method of claim 1 , wherein structurally modifying at least one of the connections comprises removing an electrical jumper from a particular connection such that, by removing the electrical jumper, a gap is defined and the particular connection is structurally modified from the electrically closed configuration to the electrically open configuration.
5. The method of claim 4 , wherein removing an electrical jumper comprises at least one of mechanical material removal, chemical etching, ablating the jumper, burning the jumper, melting the jumper, applying radiation, applying ultraviolet radiation, applying laser radiation, applying electrical current, applying electrical voltage, and applying heat.
6. The method of claim 1 , wherein disposing a plurality of connections on the substrate in one-to-one correspondence with the band filters comprises disposing a plurality of switches in one-to-one correspondence with the band filters, and wherein structurally modifying at least one of the connections comprises switching at least one of the switches from the electrically open configuration to the electrically closed configuration or from the electrically closed configuration to the electrically open configuration.
7. The method of claim 1 , wherein disposing a plurality of band filters on the substrate comprises disposing a plurality of band-pass filters on the substrate or disposing a plurality of band-stop filters on the substrate.
8. The method of claim 1 , wherein disposing a plurality of band filters on the substrate comprises disposing at least one surface acoustic wave (SAW) filter on the substrate.
9. The method of claim 1 , wherein disposing a plurality of band filters on the substrate comprises disposing at least one micro-electromechanical system (MEMS) device on the substrate.
10. A method of modifying a filter assembly, the method comprising:
providing a filter assembly that includes at least:
a substrate;
an electrically conductive input member disposed on the substrate;
an electrically conductive output member disposed on the substrate;
a plurality of band filters disposed on the substrate, wherein each band filter is structured to pass or stop oscillatory electrical signals in a respective frequency band; and
a plurality of connections disposed on the substrate in one-to-one correspondence with the band filters, wherein the connections are structured such that every connection is disposed in an electrically non-conductive open configuration or such that every connection is disposed in an electrically conductive closed configuration,
the method further comprising structurally modifying at least one of the connections from the electrically open configuration to the electrically closed configuration or from the electrically closed configuration to the electrically open configuration,
wherein, at least upon structurally modifying at least one of the connections, a transmission path for oscillatory electrical signals is defined between the input member and the output member, through which transmission path oscillatory electrical signals in at least one said frequency band is attenuated or blocked from passing from the input member to the output member.
11. The method of claim 10 , wherein structurally modifying at least one of the connections comprises disposing an electrical jumper across a gap defined by a particular connection such that, by disposing the electrical jumper, the particular connection is structurally modified from the electrically open configuration to the electrically closed configuration.
12. The method of claim 11 , wherein disposing an electrical jumper across a gap comprises disposing electrically conductive material across the gap by at least one of chemical vapor deposition, sputtering, epitaxial growth, solder reflowing, and placement of an electrically conductive member.
13. The method of claim 10 , wherein structurally modifying at least one of the connections comprises removing an electrical jumper from a particular connection such that, by removing the electrical jumper, a gap is defined and the particular connection is structurally modified from the electrically closed configuration to the electrically open configuration.
14. The method of claim 13 , wherein removing an electrical jumper comprises at least one of mechanical material removal, chemical etching, ablating the jumper, burning the jumper, melting the jumper, applying radiation, applying ultraviolet radiation, applying laser radiation, applying electrical current, applying electrical voltage, and applying heat.
15. The method of claim 10 , wherein the plurality of connections disposed on the substrate in one-to-one correspondence with the band filters comprises a plurality of switches in one-to-one correspondence with the band filters, and wherein structurally modifying at least one of the connections comprises switching at least one of the switches from the electrically open configuration to the electrically closed configuration or from the electrically closed configuration to the electrically open configuration.
16. The method of claim 10 , wherein the plurality of band filters disposed on the substrate comprises a plurality of band-pass filters or a plurality of band-stop filters.
17. The method of claim 10 , wherein the plurality of band filters disposed on the substrate comprises a surface acoustic wave (SAW) filter or a micro-electromechanical system (MEMS) device.