Plating apparatus with direct electrolyte distribution system
View Patent ↗A plating apparatus with direct electrolyte distribution system, including one or more of the following: an electrolyte tank; an electrolyte distribution compartment within the electrolyte tank, the electrolyte distribution compartment for containing electrolyte, the electrolyte distribution compartment having a first side and a second side; a pump having a fluid connection to the electrolyte distribution compartment for applying pressure to the electrolyte; a plurality of nozzles connected to the first side of the electrolyte distribution compartment, the electrolyte being forced through the plurality of the nozzles from the electrolyte distribution compartment to a part to be plated when the pump applies pressure to the electrolyte in the electrolyte distribution compartment; an electrolyte collection compartment within the electrolyte tank, the electrolyte collection compartment being in fluid communication with the electrolyte distribution compartment; and a removable screen between the electrolyte collection compartment and the second side of the electrolyte distribution compartment.
1. A plating apparatus with a direct electrolyte distribution system, comprising:
an electrolyte tank;
an electrolyte distribution compartment, within the electrolyte tank, wherein the electrolyte distribution compartment contains electrolyte, has both a first side and a second side, and the first side is opposite the second side;
a pump having a fluid connection to the first side of the electrolyte distribution compartment;
a plurality of nozzles connected between the pump and the first side of the electrolyte distribution compartment;
an electrolyte collection compartment, within the electrolyte tank, the electrolyte collection compartment being in fluid communication with the electrolyte distribution compartment; and
a removable screen, within the electrolyte tank, located between the electrolyte collection compartment and the second side of the electrolyte distribution compartment.
2. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
a drain in the electrolyte collection compartment.
3. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
perforations in the electrolyte collection compartment, said perforations between the electrolyte in the electrolyte collection compartment and the removable screen.
4. The plating apparatus with the direct electrolyte distribution system, according to claim 3 , further comprising:
a diaphragm between the perforations and the removable screen.
5. The plating apparatus with the direct electrolyte distribution system, according to claim 4 , wherein the diaphragm is a cloth membrane.
6. The plating apparatus with the direct electrolyte distribution system, according to claim 3 , wherein the perforations in the electrolyte collection compartment are on a removable sheet.
7. The plating apparatus with the direct electrolyte distribution system, according to claim 6 , wherein the removable sheet having the perforations in the electrolyte collection compartment is not conductive.
8. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , wherein the removable screen is perforated.
9. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
a rack that holds a part to be plated.
10. The plating apparatus with the direct electrolyte distribution system, according to claim 9 , wherein the rack is in a fixed position.
11. The plating apparatus with the direct electrolyte distribution system, according to claim 9 , wherein the rack is movable.
12. The plating apparatus with the direct electrolyte distribution system, according to claim 11 , wherein the rack includes at least one feature selected from a list consisting of wheels, rollers, mechanical rails, a conveyor belt, and electrical contact rails.
13. The plating apparatus with the direct electrolyte distribution system, according to claim 11 , wherein the rack is an in and out monolith.
14. The plating apparatus with the direct electrolyte distribution system, according to claim 11 , wherein movement of the rack is automatic.
15. The plating apparatus with the direct electrolyte distribution system, according to claim 11 , wherein movement of the rack is manual.
16. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
a heat exchanger that heats the electrolyte.
17. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
a filter that traps sediment in the electrolyte.
18. The plating apparatus with the direct electrolyte distribution system, according to claim 1 , further comprising:
an overflow drainage system that drains excess electrolyte away from the electrolyte tank.
19. The plating apparatus of claim 1 , wherein both a conductive metal plate and a perforated non-conductive plate separate the electrolyte collection compartment and the second side of the electrolyte distribution compartment.
20. The plating apparatus of claim 1 , further comprising:
an overflow compartment segregated from the electrolyte tank.