Semiconductor device comprising an n-channel and p-channel MISFET
A semiconductor device has an n-channel MISFET having first diffusion layers formed in a first region of a surface portion of a semiconductor substrate so as to sandwich a first channel region therebetween, a first gate insulating film formed on the first channel region, and a first gate electrode including a first metal layer formed on the first gate insulating film, and a first n-type polysilicon film formed on the first metal layer, and a p-channel MISFET having second diffusion layers containing boron as a dopant and formed in a second region of the surface portion of the semiconductor substrate so as to sandwich a second channel region therebetween, a second gate insulating film formed on the second channel region, and a second gate electrode including a second metal layer containing nitrogen or carbon and formed on the second gate insulating film and a second n-type polysilicon film formed on the second metal layer and having a boron concentration of not more than 5×10 19 cm −3 in a portion adjacent an interface with the second metal layer.
1. A semiconductor device comprising:
an n-channel MISFET comprising first diffusion layers formed in a first region of a surface portion of a semiconductor substrate so as to sandwich a first channel region therebetween, a first gate insulating film formed on the first channel region, and a first gate electrode including a first metal film formed on the first gate insulating film, a first metal carbide film formed above the first metal film, and a first n-type polysilicon film formed on the first metal carbide film; and
a p-channel MISFET comprising second diffusion layers containing boron as a dopant and formed in a second region of the surface portion of the semiconductor substrate so as to sandwich a second channel region therebetween, a second gate insulating film formed on the second channel region, and a second gate electrode including a second metal film formed on the second gate insulating film, a second metal carbide film formed above the second metal film, and a second n-type polysilicon film which is formed on the second metal carbide film and has a boron concentration of not more than 5×10 19 cm −3 in a portion adjacent to an interface with the second metal carbide film; and
the semiconductor device further comprising a third metal film between the second metal film and the second metal carbide film, wherein the first metal film and the third metal film contain the same metallic element.
2. The semiconductor device according to claim 1 , wherein the second n-type polysilicon film has a boron concentration of not more than 1×10 19 cm −3 in the portion adjacent the interface with the second metal layer carbide film.
3. The semiconductor device according to claim 1 , wherein the first metal film has a work function of not more than 4.3 eV, while the second metal film has a work function of not less than 4.8 eV.
4. The semiconductor device according to claim 1 , wherein the first and second gate insulating films each contain any one of oxides of Hf, Zr, Ti, Ta, Al, Sr, Y, and La.
5. A semiconductor device comprising:
an n-channel MISFET comprising first diffusion layers formed in a first region of a surface portion of a semiconductor substrate so as to sandwich a first channel region therebetween, a first gate insulating film formed on the first channel region, and a first gate electrode including a first metal film formed on the first gate insulating film, a first metal carbide film formed above the first metal film, and a first n-type polysilicon film formed on the first metal carbide film; and
a p-channel MISFET comprising second diffusion layers containing boron as a dopant and formed in a second region of the surface portion of the semiconductor substrate so as to sandwich a second channel region therebetween, a second gate insulating film formed on the second channel region, and a second gate electrode including a second metal film formed on the second gate insulating film, a second metal carbide film formed above the second metal film, and a second n-type polysilicon film which is formed on the second metal carbide film and has a boron concentration of not more than 5×10 19 cm −3 in a portion adjacent to an interface with the second metal carbide film; and
the semiconductor device further comprising a third metal film between the first metal film and the first metal carbide film, wherein the second metal film and the third metal film contain the same metallic element.