IP Library Granted Patent US 7,789,674
Granted Patent B2
US 7,789,674 · App. 12/114,600 · Granted Sep 7, 2010

Molded card edge connector for attachment with a printed circuit board

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Quick Facts
Patent No.
US 7,789,674
App. No.
12/114,600
Granted
Sep 7, 2010
Kind
B2
Abstract

An edge connector suitable for attachment with a printed circuit board. The edge connector comprises a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device and a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board.

Claims (28)

1. An edge connector suitable for attachment with a printed circuit board, comprising:

a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device;

a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board; and

a component pocket configured to receive an electrical component, wherein the component pocket is sunken with respect to surface of the body such that the electrical component is positioned substantially level with a surface of the body when placed in the component pocket and wherein the component pocket includes one or more conductive pads for electrically coupling the electrical component with one or more of the conductive traces defined on the surface.

2. The edge connector in accordance with claim 1 , wherein the surface portion whereon the traces and contact pads are defined has been previously laser etched.

3. The edge connector in accordance with claim 1 , wherein the body is injection molded and wherein the plastic resin contains a palladium catalyst.

4. The edge connector in accordance with claim 1 , wherein the plurality of conductive traces are defined on a portion of a top body surface and a portion of a bottom body surface, further comprising:

a via defined through the body so as to extend from the top surface to the bottom surface, wherein the via is configured to allow signals transmitted on the plurality of conductive traces to be transferred from one body surface to the other body surface.

5. The edge connector in accordance with claim 1 , further comprising:

one or more substantially vertical ridges configured to have conductive traces defined on opposing sides of the ridges such that effective impedance is defined between the traces.

6. The edge connector in accordance with claim 1 , further comprising:

one or more of the plurality of traces passing around one or more edges of the edge connector.

7. The edge connector in accordance with claim 1 , further comprising:

at least two reference features defined by the body, the reference features for use in defining the conductive traces and pads on a portion of the body surface.

8. The edge connector in accordance with claim 1 , wherein the edge connector is implemented in an optical transceiver.

9. An edge connector suitable for attachment with a printed circuit board, comprising:

a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device;

a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board;

one or more substantially vertical ridges configured to have conductive traces defined on opposing sides of the ridges such that effective impedance is defined between the traces; and

one or more troughs defined on a top surface of the edge connector, wherein the one or more troughs are configured to allow the one or more substantially vertical ridges to extend into the body of the edge connector is such as way as to not exceed a predetermined height.

10. An edge connector suitable for attachment with a printed circuit board, comprising:

a body composed of a plastic resin, the body defining a first end that is configured to operably attach to a portion of a printed circuit board and a second end configured to operably connect to a slot in a host device;

a plurality of conductive traces and contact pads defined on a portion of a surface of the body, the traces being configured to electrically connect with corresponding traces defined on the printed circuit board;

at least one interconnection mechanism defined in the first end configured to connect the edge connector with the printed circuit board; and

an electrical interconnect configured to electrically interconnect the plurality of conductive traces with a plurality of conductive traces located on a portion of the printed circuit board when the first end of the body is to be attached to the printed circuit board, wherein the at least one electrical interconnect comprises a wirebond configured to attach to the plurality of conductive traces of the edge connector and the plurality of conductive traces of the printed circuit board.

11. The edge connector in accordance with claim 10 , wherein the body is injection molded and wherein the plastic resin contains a palladium catalyst.

12. The edge connector in accordance with claim 10 , wherein the at least one interconnection mechanism comprises one or more attachment bars configured to be fixedly secured to both the edge connector and the printed circuit board across the mating interface therebetween.

13. The edge connector in accordance with claim 10 , wherein the at least one interconnection mechanism comprises one or more bonding edges configured to mate with corresponding bonding edges of the printed circuit board, the bonding edges configured to receive an adhesive.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2008
From: NELSON, STEPHEN T.; ICE, DONALD A.; DOUMA, DARIN JAMES
To: FINISAR CORPORATION
Reel/Frame 021484/0121 →