IP Library Patent Application 12114922
Patent Application
App. No. 12/114,922

METHOD FOR JOINING COMPONENTS MADE OF A HIGH-STRENGTH ALUMINUM MATERIAL AND HEAT EXCHANGER ASSEMBLED ACCORDING TO THE METHOD

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Quick Facts
Patent No.
US None
App. No.
12/114,922
Abstract

The invention relates to a method for joining components made of a high-strength aluminum material, whereby at least two components of high-strength aluminum alloys are joined by soldering, both components separated from each other by at least one aluminum layer with a lower magnesium content compared with the contact surfaces before joining is carried out, and a heat exchanger produced according to this method.

Claims (31)

1 . A method of joining components, the method comprising the steps of:

(a) providing at least two components made of high strength aluminum alloys containing magnesium;

(b) placing a contact surface of each of the components to be joined adjacent each other;

(c) providing at least one aluminum layer having a low magnesium content between the contact surfaces of the components to separate the components; and

(d) soldering the components and the aluminum layer to connect the components.

2 . The method according to claim 1 , wherein step (d) includes soldering the components and the aluminum layer using one of a controlled atmosphere brazing technique and flame soldering with one of a corrosive and non-corrosive fluxing agent.

3 . The method according to claim 1 , wherein step (d) includes soldering the components and the aluminum layer using a controlled atmosphere brazing technique with a fluxing agent that contains cesium.

4 . The method according to claim 1 , wherein step (c) includes applying an aluminum layer of a 1xxx or 3xxx alloy having a lower magnesium content than the components to at least one of the contact surfaces of the components to separate the components.

5 . The method according to claim 4 , further comprising the step of disposing a solder on an edge of a solder gap, wherein the solder is one of a paste, a wire, and a ring.

6 . The method according to claim 4 , further comprising the step of inserting the solder into the solder gap.

7 . The method according to claim 1 , wherein step (c) includes inserting a molded part produced at least partially of aluminum having a lower magnesium content than the components into the solder gap to separate the components.

8 . The method according to claim 1 , wherein step (c) includes inserting a molded part with a plurality of aluminum layers with at least one of a 4xxx, a 3xxx, and a 1xxx alloy, having a lower magnesium content than the components into the solder gap to separate the components.

9 . The method according to claim 1 , wherein step (c) includes providing at least one aluminum layer on at least one of the components to be joined using a plasma supported vapor deposition process to separate the components.

10 . The method according to claim 1 , wherein step (c) includes providing at least one aluminum layer on at least one of the components to be joined using one of a single sided and a double sided solder plating process to separate the components.

11 . The method according to claim 1 , wherein step (c) includes providing at least one aluminum layer of 4xxx, 3xxx, and 1xxx on at least one of the contact surfaces to separate the components.

12 . A method of joining components, the method comprising the steps of:

(a) providing at least two components made of high strength aluminum alloys containing magnesium;

(b) placing a contact surface of each of the components to be joined adjacent each other;

(c) applying at least one aluminum layer of at least one of a 1xxx and a 3xxx alloy having a lower magnesium content compared to the components to at least one of the contact surfaces to separate the components; and

(d) soldering the components and the aluminum layer to connect the components.

13 . The method according to claim 12 , wherein step (c) includes inserting a molded part having a plurality of aluminum layers of at least one of a 4xxx, a 3xxx and a 1xxx alloy having a lower magnesium content as compared with the components, into the solder gap, to separate the components.

14 . The method according to claim 12 , wherein step (c) includes providing at least one aluminum layer to at least one of the components to be joined using a plasma supported vapor deposition process to separate the components.

15 . The method according to claim 12 , wherein step (c) includes providing at least one aluminum layer to at least one of the components to be joined using one of a single sided and a double sided solder plating process to separate the components.

16 . The method according to claim 12 , wherein step (c) includes providing a layer of at least one of a 4xxx, a 3xxx, and a 1xxx alloy to at least one of the contact surfaces to separate the components.

17 . A heat exchanger comprising:

a first heat exchanger component produced from a high strength aluminum alloy containing magnesium;

a second heat exchanger component produced from a high strength aluminum alloy containing magnesium; and

a solder connection disposed between said first heat exchanger component and said second heat exchanger component, wherein said solder connection includes at least one aluminum alloy layer having a lower magnesium content than said first heat exchanger component and said second heat exchanger component.

18 . The heat exchanger according to claim 17 , wherein said first heat exchanger component is one of a collection tank, a connecting block, a distributor tube, and a distributor, and said second heat exchanger component is one of a collection tank, a connecting block, a distributor tube, and a distributor.

19 . The heat exchanger according to claim 17 , wherein said solder connection includes at least one aluminum alloy layer having a lower magnesium content than said first heat exchanger component and said second heat exchanger component separating said components.

20 . The heat exchanger according to claim 17 , wherein at least one of said first heat exchanger component and said second heat exchanger component includes at least one aluminum alloy layer provided by a plasma supported vapor deposition process.

Assignments (9)
CHANGE OF NAME Recorded Oct 30, 2015
From: HALLA VISTEON CLIMATE CONTROL CORPORATION
To: HANON SYSTEMS
Reel/Frame 037007/0103 →
RELEASE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Jun 9, 2014
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 033107/0717 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 2, 2013
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: HALLA VISTEON CLIMATE CONTROL CORPORATION
Reel/Frame 030935/0958 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS ON REEL 025241 FRAME 0317 Recorded Apr 26, 2011
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
Reel/Frame 026178/0412 →
SECURITY AGREEMENT (REVOLVER) Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDINGS, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025238/0298 →
SECURITY AGREEMENT Recorded Oct 19, 2010
From: VISTEON CORPORATION; VC AVIATION SERVICES, LLC; VISTEON ELECTRONICS CORPORATION; VISTEON GLOBAL TECHNOLOGIES, INC.; VISTEON INTERNATIONAL HOLDINGS, INC.; VISTEON GLOBAL TREASURY, INC.; VISTEON EUROPEAN HOLDING, INC.; VISTEON SYSTEMS, LLC; VISTEON INTERNATIONAL BUSINESS DEVELOPMENT, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS AGENT
Reel/Frame 025241/0317 →
RELEASE BY SECURED PARTY AGAINST SECURITY INTEREST IN PATENTS RECORDED AT REEL 022619 FRAME 0938 Recorded Oct 6, 2010
From: WILMINGTON TRUST FSB
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 025095/0466 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded May 1, 2009
From: VISTEON GLOBAL TECHNOLOGIES, INC.
To: WILMINGTON TRUST FSB, AS ADMINISTRATIVE AGENT
Reel/Frame 022619/0938 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 22, 2008
From: HOFFMANN, HANSKARL; RAJAGOPALAN, RAHUL
To: VISTEON GLOBAL TECHNOLOGIES, INC.
Reel/Frame 021720/0316 →