Cavity exploration with an image sensor

1. A process, comprising:

manufacturing a head of a cavity exploration device, the head including an integrated circuit support presenting first and second surfaces, and a plurality of through-holes associated with respective first and second conducting pads respectively placed on the first and second surfaces of the integrated circuit support, by:

positioning respective conducting micro-cables in the through-holes, the micro-cables having an uninsulated portion of a length greater than or equal to a thickness of the support;

soldering the micro-cables onto the first and second associated conducting pads;

gluing the micro-cables with a glue onto the first and second associated conducting pads; and

molding the micro-cable in first and second layers of resin onto the respective first and second conducting pads, with said resin layers covering the uninsulated portion of said micro-cable.

2. The process for manufacturing a head according to claim 1 wherein the integrated circuit support comprises an image sensor.

3. The process for manufacturing a head according to claim 2 wherein the image sensor is a CMOS sensor.

4. The process for manufacturing a head according to claim 1 wherein the integrated circuit support comprises at least one light-emitting diode.

5. The process for manufacturing a head according to claim 1 wherein the integrated circuit support has a hole adapted to receive a tool for performing operations in the cavity.

6. The process for manufacturing a head according to claim 1 wherein the integrated circuit support has a hole adapted to receive a tube for carrying water.

7. The process of claim 2 wherein the head comprises first and second exploratory surfaces, the integrated circuit support is a first integrated circuit support and the image sensor is a first image sensor, the process further comprising:

configuring the first integrated circuit support to position the first image sensor on the first exploratory surface of the head to capture images of a first region of the cavity;

providing a second integrated circuit support in the head, the second integrated circuit support having a second image sensor, and presenting first and second surfaces, and a plurality of through-holes associated with respective first and second conducting pads respectively placed on the first and second surfaces of the second integrated circuit support:

positioning respective conducting micro-cables in the through-holes of the second integrated circuit support, the micro-cables having an uninsulated portion of a length greater than or equal to a thickness of the second integrated circuit support;

soldering the micro-cables positioned in the through-holes of the second integrated circuit support onto the first and second associated conducting pads;

gluing the micro-cables positioned in the through-holes of the second integrated circuit with glue onto the first and second associated conducting pads;

molding the micro-cable in first and second layers of resin onto the respective first and second conducting pads of the second integrated circuit support, with the resin layers covering the uninsulated portion of the respective micro-cables; and

configuring the second integrated circuit support to position the second image sensor on the second exploratory surface of the head to capture images of a second region of the cavity, distinct from the first region of the cavity.

8. A head of a cavity exploration device, comprising:

an integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads respectively placed on the first and second surfaces of the integrated circuit support; and

a plurality of corresponding micro-cables, the micro-cables having a portion which is uninsulated for a length greater than or equal to a thickness of the support, soldered and glued to the first and second associated conducting pads, and molded in first and second layers of resin onto the respective first and second conducting pads, with said resin layers covering the uninsulated portion of the micro-cables.

9. The head of claim 8 , further comprising an image sensor coupled to the integrated circuit support.

10. The head of claim 9 , further comprising a light-emitting diode coupled to the integrated circuit support, wherein the image sensor is an image sensor of an endoscope.

11. The head of claim 8 wherein the integrated circuit support is a first integrated circuit support having a first image sensor configured to capture images of a first region of the cavity, the head further comprising:

a second integrated circuit support which has first and second surfaces and a plurality of through-holes associated with corresponding first and second conducting pads respectively placed on the first and second surfaces of the second integrated circuit support; and

a second plurality of corresponding micro-cables having a portion which is uninsulated for a length greater than or equal to a thickness of the second integrated circuit support, soldered and glued to the first and second associated conducting pads of the second integrated circuit support and molded in first and second layers of resin onto the respective first and second conducting pads of the second integrated circuit support, with the resin layers covering the uninsulated portion of the second plurality of microcables, wherein the second integrated circuit support has a second image sensor configured to capture images of a second region of the cavity, the second region being distinct from the first region.

12. The head of claim 11 wherein the first integrated circuit support is configured to support the first image sensor along a lateral surface of the head and the second integrated circuit support is configured to support the second image sensor along a front surface of the head.