Dual interface inlays
View Patent ↗A dual interface inlay having a bottom sheet; an antenna wire mounted to the top surface of the bottom sheet; end portions of the antenna wire formed with squiggles or meanders forming contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire; conductive material applied to the end portions of the antenna wire; a top sheet disposed over the bottom sheet for lamination thereto; and recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact area. The antenna wire may be insulated wire, and insulation may be removed from the end portions of the antenna wire. Silicon cushions may be disposed in the bottom sheet under the contact areas.
1. A dual interface inlay comprising:
a bottom sheet;
a transponder site on a top surface of the bottom sheet;
an antenna wire mounted to the top surface of the bottom sheet;
end portions of the antenna wire are formed with squiggles or meanders forming contact areas on opposite sides of the transponder site to provide areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire;
conductive material applied to the end portions of the antenna wire;
a top sheet disposed over the bottom sheet for lamination thereto; and
recesses formed in a bottom surface of the top sheet, at positions corresponding to the contact areas;
further comprising:
silicon cushions disposed in the bottom sheet under the contact areas.
2. The inlay of claim 1 , further comprising:
a cavity extending through the top sheet to (i) allow a chip module to be mounted through the top sheet onto the surface of the bottom sheet, and (ii) to expose the contact areas ( 210 a /b).
3. The inlay of claim 1 , wherein:
the antenna wire is embedded or adhesively placed on the surface of the substrate.
4. The inlay of claim 1 , wherein:
the bottom sheet comprises a synthetic material in a credit card format.
5. The inlay of claim 4 , wherein:
the synthetic material comprises PVC (polyvinyl chloride).
6. The inlay of claim 1 , wherein:
the antenna wire is insulated wire, and insulation is removed from the end portions of the antenna wire.
7. The inlay of claim 1 , wherein:
the conductive material on the end portions of the antenna wire comprises solder balls or flexible solder paste, or conductive glue.
8. The inlay of claim 1 , further comprising:
an overlay sheet disposed below the bottom sheet.
9. The inlay of claim 8 , further comprising:
a lower printed laminate disposed under the overlay sheet.
10. The inlay of claim 1 , wherein:
the chip module comprises:
a substrate;
a chip covered by a mold mass and connected to conductive traces on the substrate;
“face-up” terminals disposed on a bottom surface of the substrate for connecting to the contact areas, respectively; and
“face-down” terminals on a top surface of the substrate for making contact connections with an external apparatus.
11. The inlay of claim 10 , further comprising:
a recess in the top surface of the bottom sheet for accepting the mold mass.
12. The inlay of claim 10 , further comprising:
solder paste or balls disposed on the face-up terminals.
13. The inlay of claim 10 , further comprising:
part A of a two-part conductive adhesive system disposed on the face-up terminals; and
part B of the two-part conductive adhesive system disposed on the contact areas.
14. The inlay of claim 10 , further comprising:
an upper printed laminate disposed on the top sheet with an opening large enough for the face-down terminals to be exposed.
15. The inlay of claim 10 , further comprising:
adhesive for securing the mold mass to the bottom sheet.
16. The inlay of claim 10 , wherein:
the external apparatus comprises an automatic teller machine (ATM).
17. A method of making a dual interface interlay comprising:
mounting an antenna wire to a bottom sheet;
forming end portions of the antenna wire with squiggles or meanders to provide contact areas of increased surface area for subsequent attachment of a chip or chip module to the antenna wire;
applying conductive material to the end portions of the antenna wire;
disposing a top sheet over the bottom sheet for lamination thereto; and
forming recesses in a bottom surface of the top sheet, at positions corresponding to the contact areas;
further comprising:
providing silicon cushions in the bottom sheet under the contact areas.
18. The method of claim 17 , wherein the antenna wire is insulated wire, further comprising:
removing insulation from the end portions of the antenna wire.
19. The method of claim 17 , wherein:
the conductive material on the end portions of the antenna wire comprises solder balls or flexible solder paste, or conductive glue.
20. The method of claim 17 , further comprising:
providing a cavity extending through the top sheet; and
mounting a chip module through the top sheet onto the bottom sheet.