IP Library Patent Application 12117992
Patent Application
App. No. 12/117,992

METHOD OF MANUFACTURING OF SUBSTRATE

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Patent No.
US None
App. No.
12/117,992
Abstract

A method of manufacturing a substrate is provided for readily processing a substrate in the presence of a supercritical fluid in a deposition step, an etching step, a resist peeling step and the like. The method of manufacturing a substrate of the present invention is a method of manufacturing a substrate for processing a surface of the substrate by filling a liquid fluid in a reaction chamber in which the substrate is placed, and reacting a precursor solved in the liquid fluid in the vicinity of the surface of the substrate, wherein the substrate is placed on a ceiling of the reaction chamber with the surface of the substrate oriented downward.

Claims (16)

1 . A method of manufacturing a substrate for processing a surface of the substrate by filling a liquid fluid in a reaction chamber in which the substrate is placed, and reacting a precursor solved in the liquid fluid in the vicinity of the surface of the substrate, wherein said substrate is placed on a ceiling of said reaction chamber with the surface of the substrate oriented downward.

2 . The method of manufacturing a substrate according to claim 1 , wherein said substrate is heated from a back side of the substrate.

3 . The method of manufacturing a substrate according to claim 2 , wherein heat insulation is provided between heating means for heating the substrate and an inner wall of said reaction chamber.

4 . The method of manufacturing a substrate according to claim 1 , wherein a flow regulation plate is disposed at a position opposite to the surface of the substrate.

5 . The method of manufacturing a substrate according to claim 4 , wherein a gap between the surface of the substrate and said flow regulation plate is set to 20 mm or less.

6 . The method of manufacturing a substrate according to claim 5 , wherein said reaction chamber is divided into a first reaction chamber and a second reaction chamber by said flow regulation plate, and said first reaction chamber is held at the same pressure as said second reaction chamber.

7 . The method of manufacturing a substrate according to claim 6 , wherein said liquid fluid is supplied to said second reaction chamber.

8 . The method of manufacturing a substrate according to claim 1 , wherein said liquid fluid is a supercritical fluid.

9 . A method of manufacturing a substrate for processing a surface of the substrate by filling a liquid fluid in a reaction chamber in which the substrate is placed, and reacting a precursor solved in the liquid fluid in the vicinity of the surface of the substrate, wherein said substrate is placed in a direction in which heat rises due to a convection of the liquid fluid.

10 . The method of manufacturing a substrate according to claim 9 , wherein said substrate is heated from a back side of the substrate.

11 . The method of manufacturing a substrate according to claim 10 , wherein heat insulation is provided between heating means for heating the substrate and an inner wall of said reaction chamber.

12 . The method of manufacturing a substrate according to claim 9 , wherein a flow regulation plate is disposed at a position opposite to the surface of the substrate.

13 . The method of manufacturing a substrate according to claim 12 , wherein a gap between the surface of the substrate and said flow regulation plate is set to 20 mm or less.

14 . The method of manufacturing a substrate according to claim 12 , wherein said reaction chamber is divided into a first reaction chamber and a second reaction chamber by said flow regulation plate, and said first reaction chamber is held at the same pressure as said second reaction chamber.

15 . The method of manufacturing a substrate according to claim 14 , wherein said liquid fluid is supplied to said second reaction chamber.

16 . The method of manufacturing a substrate according to claim 9 , wherein said liquid fluid is a supercritical fluid.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032895/0466 →
SECURITY AGREEMENT Recorded Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2008
From: ODE, HIROYUKI
To: ELPIDA MEMORY, INC.
Reel/Frame 021646/0582 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 8, 2008
From: ODE, HIROYUKI
To: ELPIDA MEMORY, INC.
Reel/Frame 021646/0633 →