Methods and apparatus for processing a large area pulsed laser beam to create apertures through microlens arrays
View Patent ↗A pulsed laser beam is used to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof. The pulsed laser beam is focused in a vacuum spatial filter. A profile of the pulsed laser beam that emerges from the vacuum spatial filter is converted to a top hat profile. The laser beam having the top hat profile is diffused. Finally, the pulsed laser beam having the top half profile that has been diffused is impinged through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate. Related apparatus for creating the apertures and microlens array products are also described.
1. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:
impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,
wherein the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof is configured for visible light applications and wherein the pulsed laser beam is a pulsed laser beam having longer wavelength than visible light, and
wherein the pulsed laser beam is at least one inch square in area where the pulsed laser beam impinges on the substrate and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.
2. A method according to claim 1 wherein impinging the pulsed laser beam comprises moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer.
3. A method according to claim 2 wherein moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer is performed so as to overlap impingement areas of the pulsed laser beam on the substrate in both the given direction and perpendicular to the given direction.
4. A method according to claim 1 wherein the pulsed laser beam is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, without visible defects, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.
5. A method according to claim 1 wherein the pulsed laser beam is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, with non-visible defects that have a periodicity of at least about one inch, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.
6. A method according to claim 1 wherein the pulsed laser beam is a pulsed infrared laser beam.
7. A method according to claim 1 wherein at least some of the apertures include debris from the layer in the centers thereof.
8. An apparatus that is configured to perform the method of claim 1 .
9. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:
impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate,
wherein the pulsed laser beam is at least one inch square in area where the pulsed laser beam impinges on the substrate and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.
10. A method according to claim 9 wherein impinging the pulsed laser beam comprises moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer.
11. A method according to claim 9 wherein the pulsed laser beam is sufficiently uniform in power to create the apertures in the layer on the back side of the substrate, with non-visible defects that have a periodicity of at least about one inch.
12. A method according to claim 9 wherein at least some of the apertures include debris from the layer in the centers thereof.
13. An apparatus that is configured to perform the method of claim 9 .
14. A method of optically processing a pulsed laser beam to create apertures in a layer on a back side of a substrate that includes a microlens array on a front side thereof, the method comprising:
impinging the pulsed laser beam through the microlens array on the front side of the substrate and onto the layer on the back side of the substrate, so as to create a given aperture through a given microlens of the microlens array using a single pulse of the pulsed laser beam,
wherein the pulsed laser beam is at least one inch square in area where the pulsed laser beam impinges on the substrate and is sufficiently uniform in power to create apertures in the layer on the back side of the substrate through all of the microlenses in the microlens array on the front side thereof on which the at least one inch square pulsed laser beam impinges, wherein the microlenses include at least one base dimension that is less than about 100 μm in size.
15. A method according to claim 14 wherein impinging the pulsed laser beam comprises moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer.
16. A method according to claim 14 wherein moving the substrate that includes the microlens array on the front side thereof and the layer on the back side thereof in a given direction while rastering the pulsed laser beam across the substrate perpendicular to the given direction to create the apertures in the layer is performed so as to overlap impingement areas of the pulsed laser beam on the substrate in both the given direction and perpendicular to the given direction.
17. A method according to claim 14 wherein at least some of the apertures include debris from the layer in the centers thereof.
18. An apparatus that is configured to perform the method of claim 14 .