Thin solid electrolytic capacitor having high resistance to thermal stress
View Patent ↗In a thin solid electrolytic capacitor including a solid electrolytic capacitor element disposed on a substrate, the solid electrolytic capacitor element has an upper surface largely extending along the substrate as compared with a height dimension thereof from the substrate. A casing portion is at least partly made of a resin and surrounds the solid electrolytic capacitor element jointly with the substrate. The casing portion includes a non-adhesive member that is in contact with an upper surface of the solid electrolytic capacitor element, but is not adhesive to the solid electrolytic capacitor element.
1. A thin solid electrolytic capacitor, comprising:
a substrate;
a solid electrolytic capacitor element which is disposed on the substrate and which has an upper surface extending farther in a dimension along the substrate than in a height dimension thereof from the substrate; and
a casing portion which is at least partly made of a resin and which surrounds the solid electrolytic capacitor element jointly with the substrate;
wherein the casing portion comprises:
a non-adhesive member which is in contact with the upper surface of the solid electrolytic capacitor element, and which is not adhered to the solid electrolytic capacitor element; and
a cover member which is connected to the non-adhesive member and the substrate, and which covers the solid electrolytic capacitor element and the non-adhesive member.
2. The thin solid electrolytic capacitor according to claim 1 , wherein the solid electrolytic capacitor element comprises:
a plate-like or foil-like base member which is made of a valve-acting metal and which is fixed to the substrate;
an anode conductor portion which is connected to a part of the base member;
a cathode conductor portion which faces another part of the base member; and
a solid electrolyte layer which is interposed between the cathode conductor portion and the base member.
3. The thin solid electrolytic capacitor according to claim 2 ,
wherein the cathode conductor portion comprises:
a surface silver layer; and
a graphite layer which is interposed between the silver layer and the solid electrolyte layer.
4. The thin solid electrolytic capacitor according to claim 2 , wherein the solid electrolytic capacitor element further comprises a dielectric layer which is made of an oxide of the base member and which is interposed between the solid electrolyte layer and the base member.
5. The thin solid electrolytic capacitor according to claim 4 , wherein the dielectric layer, the solid electrolyte layer, the cathode conductor portion, and the anode conductor portion are disposed between the substrate and the base member.
6. The thin solid electrolytic capacitor according to claim 5 , further comprising an insulating portion formed between (i) the anode conductor portion and (ii) the dielectric layer, the solid electrolyte layer, and the cathode conductor portion.
7. The thin solid electrolytic capacitor according to claim 4 , wherein the dielectric layer, the solid electrolyte layer, and the cathode conductor portion are disposed on a side opposite to the base member with respect to the substrate, and the anode conductor portion is disposed between the substrate and the base member.
8. The thin solid electrolytic capacitor according to claim 4 , wherein the dielectric layer, the solid electrolyte layer, and the cathode conductor portion are disposed on each of mutually opposite sides of the base member.
9. The thin solid electrolytic capacitor according to claim 1 , wherein the cover member is made of an adhesive resin.
10. The thin solid electrolytic capacitor according to claim 1 , wherein the cover member is made of a prepreg.
11. The thin solid electrolytic capacitor according to claim 1 ,
wherein the non-adhesive member comprises:
a first portion being in contact with the upper surface of the solid electrolytic capacitor element; and
a second portion extending from the first portion and embedded in the cover member.
12. The thin solid electrolytic capacitor according to claim 11 , wherein the second portion includes a plurality of openings, and wherein the cover member enters the openings.
13. The thin solid electrolytic capacitor according to claim 11 , wherein the second portion includes a plurality of cutouts, and wherein the cover member enters the cutouts.
14. The thin solid electrolytic capacitor according to claim 1 , wherein the casing portion comprises an adhesive connected to the substrate and disposed around the solid electrolytic capacitor element, and wherein the non-adhesive member is fixed to the substrate by the adhesive.
15. The thin solid electrolytic capacitor according to claim 14 ,
wherein the non-adhesive member comprises:
a first portion which is in contact with the upper surface of the solid electrolytic capacitor element; and
a second portion which extends from the first portion and which is fixed to the adhesive.
16. The thin solid electrolytic capacitor according to claim 1 , wherein the non-adhesive member is made of at least one of a polyimide, a liquid crystal polymer, a fluororesin, and a heat-resistant polystyrene.
17. A thin solid electrolytic capacitor, comprising:
a substrate;
a solid electrolytic capacitor element which is disposed on the substrate and which has an upper surface extending farther in a dimension along the substrate than in a height dimension thereof from the substrate; and
a casing portion which is at least partly made of a resin and which surrounds the solid electrolytic capacitor element jointly with the substrate;
wherein the casing portion is entirely made of a non-adhesive member and is connected to the substrate;
wherein the non-adhesive member is in contact with the upper surface of the solid electrolytic capacitor element, and is not adhered to the solid electrolytic capacitor element.
18. The thin solid electrolytic capacitor according to claim 17 , wherein the casing portion is bonded to the substrate by an adhesive, so that the substrate and the casing portion jointly seal the solid electrolytic capacitor element.
19. The thin solid electrolytic capacitor according to claim 17 , wherein the casing portion is fusion-bonded to the substrate, so that the substrate and the casing portion jointly seal the solid electrolytic capacitor element.
20. The thin solid electrolytic capacitor according to claim 17 , wherein the non-adhesive member is made of at least one of a polyimide, a liquid crystal polymer, a fluororesin, and a heat-resistant polystyrene.
21. The thin solid electrolytic capacitor according to claim 17 , wherein the solid electrolytic capacitor element comprises:
a plate-like or foil-like base member which is made of a valve-acting metal and which is fixed to the substrate;
an anode conductor portion which is connected to a part of the base member;
a cathode conductor portion which faces another part of the base member; and
a solid electrolyte layer which is interposed between the cathode conductor portion and the base member.
22. The thin solid electrolytic capacitor according to claim 21 ,
wherein the cathode conductor portion comprises:
a surface silver layer; and
a graphite layer which is interposed between the silver layer and the solid electrolyte layer.
23. The thin solid electrolytic capacitor according to claim 21 , wherein the solid electrolytic capacitor element further comprises a dielectric layer which is made of an oxide of the base member and which is interposed between the solid electrolyte layer and the base member.
24. The thin solid electrolytic capacitor according to claim 23 , wherein the dielectric layer, the solid electrolyte layer, the cathode conductor portion, and the anode conductor portion are disposed between the substrate and the base member.
25. The thin solid electrolytic capacitor according to claim 24 , further comprising an insulating portion formed between (i) the anode conductor portion and (ii) the dielectric layer, the solid electrolyte layer, and the cathode conductor portion.
26. The thin solid electrolytic capacitor according to claim 23 , wherein the dielectric layer, the solid electrolyte layer, and the cathode conductor portion are disposed on a side opposite to the base member with respect to the substrate, and the anode conductor portion is disposed between the substrate and the base member.
27. The thin solid electrolytic capacitor according to claim 23 , wherein the dielectric layer, the solid electrolyte layer, and the cathode conductor portion are disposed on each of mutually opposite sides of the base member.