IP Library Granted Patent US 8,006,370
Granted Patent B2
US 8,006,370 · App. 12/124,480 · Granted Aug 30, 2011

Method for sealing a housing

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Quick Facts
Patent No.
US 8,006,370
App. No.
12/124,480
Granted
Aug 30, 2011
Kind
B2
Abstract

A method for sealing a housing includes providing a base plate of the housing with at least one opening; providing an electrical connection that extends through the base plate from an inner side to an outer side of the base plate; and applying a sealing compound into the opening from an outer side of the base plate in order to seal an interface between the base plate and the electrical connection.

Claims (21)

1. A method for sealing a housing, comprising:

providing a base plate of the housing with a first opening and a second opening;

providing an electrical connection that extends through the first opening from an inner side to an outer side of the base plate; and

applying a sealing compound into the second opening from an outer side of the base plate in order to seal an interface between the base plate and the electrical connection.

2. The method of claim 1 , wherein a free space is formed at the interface between the base plate and the electrical connection.

3. The method of claim 1 , wherein the second opening receives a latch after the sealing compound is applied.

4. The method of claim 1 , wherein the second opening is remote from the electrical connection.

5. The method of claim 1 , further comprising guiding the sealing compound to the interface through a gap that extends substantially transverse to the second opening.

6. The method of claim 1 , further comprising guiding the sealing compound along an uneven interior surface on the inner side of the base plate to the interface.

7. The method of claim 1 , wherein the housing is an electromagnetic relay.

8. The method of claim 1 , wherein the sealing compound is compatible with a plastic material and a metal material.

9. The method of claim 1 , further comprising providing a coil form on an inner side of the base plate.

10. The method of claim 4 , wherein a distance between the second opening and the first opening depends on a viscosity of the sealing compound.

11. The method of claim 5 , wherein the gap is provided between the base plate and the coil form.

12. The method of claim 1 , further comprising:

providing a rib on the outer side of the base plate to direct the sealing compound to the interface.

13. The method of claim 1 , wherein the second opening is configured to receive the sealing compound and a latch.

14. The method of claim 13 , further comprising

providing a third opening which is configured for receiving the sealing compound.

15. The method of claim 14 , wherein about one third by volume of the sealing compound is applied through the third opening and about two thirds by volume of the sealing compound is applied through the second opening.

16. The method of claim 6 , wherein the uneven interior surface on the inner side of the base plate includes edges, channels and ribs.

Assignments (2)
CHANGE OF NAME Recorded Sep 16, 2015
From: TYCO ELECTRONICS AMP GMBH
To: TE CONNECTIVITY GERMANY GMBH
Reel/Frame 036617/0856 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2008
From: HOFFMANN, RALF; LINKE, ALEXANDER; WIEBERGER, MARTIN; ZIEGLER, TITUS
To: TYCO ELECTRONICS AMP GMBH
Reel/Frame 020978/0860 →