IP Library Granted Patent US 8,552,338
Granted Patent B2
US 8,552,338 · App. 12/125,439 · Granted Oct 8, 2013

System and method for laser machining of three-dimensional structures

Inventors: Patrick J. Sercel (Brentwood, NH); Jeffrey P. Sercel (Hollis, NH)
Assignee: IPG Microsystems LLC
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,552,338
App. No.
12/125,439
Granted
Oct 8, 2013
Kind
B2
Abstract

A system and method of laser machining rotates a workpiece about an axis of rotation, and translates the workpiece in a first direction along the axis of rotation. A mask defining a shape is translated in a second direction opposite the first direction, and a laser beam is directed at the mask such that the laser beam is scanned across the mask and at least a portion of the laser beam passes through the mask and toward the workpiece. The mask and the workpiece are translated with coordinating opposing motion to cause the laser beam to be imaged onto the workpiece with a shape or pattern corresponding to a shape or pattern defined by the mask. Rotation of the workpiece and the shape of the image on the workpiece produce different vectorial intensities such that material of the workpiece is removed to different respective depths to form a three-dimensional structure.

Claims (16)

1. A method of machining comprising:

rotating a workpiece about an axis of rotation;

translating said workpiece in a first direction along said axis of rotation;

translating a mask in a second direction opposite said first direction, said mask defining at least one shape;

directing a laser beam at said mask such that said laser beam is scanned across said mask and at least a portion of said laser beam passes through said mask and toward said workpiece; and

coordinating opposing motion of said mask and said workpiece to cause said laser beam to be imaged onto said workpiece with a shape corresponding to said shape defined by said mask, wherein rotation of said workpiece and said shape of said laser beam imaged on said workpiece produce different vectorial intensities on said workpiece such that material of said workpiece is removed to different respective depths to form a three-dimensional structure.

2. The method of claim 1 wherein said workpiece is generally cylindrical in shape.

3. The method of claim 1 wherein said laser beam is a shaped laser beam that is longer in a first axis than a second axis, and wherein said mask is translated such that said shaped laser beam scans said mask in a direction of said second axis.

4. The method of claim 1 wherein directing said beam includes demagnifying said beam such that said shape imaged onto said workpiece is smaller than said shape on said mask.

5. The method of claim 1 wherein said laser beam is imaged onto a top surface of said workpiece.

6. The method of claim 1 wherein said laser beam is imaged onto a tangential surface of said workpiece.

7. The method of claim 1 wherein the vectorial intensities on the workpiece vary such that the vectorial intensities are higher when the shape of the beam imaged on the workpiece is wider in the direction of rotation.

8. The method of claim 1 wherein said mask includes at least one aperture having a shape including a V-shaped portion such that the vectorial intensities increase from a tip of the V-shaped portion to a wider portion of the V-shaped portion causing an increasing amount of material to be removed from the tip to the wider portion.

9. The method of claim 1 wherein rotating and translating the workpiece include engaging each end of the workpiece.

10. The method of claim 8 wherein the workpiece is placed under tension while rotating and translating.

11. The method of claim 8 wherein the workpiece is rotated with substantially no rotational torque transferred to the workpiece.

Assignments (2)
MERGER Recorded Mar 17, 2015
From: IPG MICROSYSTEMS, LLC
To: IPG PHOTONICS CORPORATION
Reel/Frame 035184/0587 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2012
From: J. P. SERCEL ASSOCIATES
To: IPG MICROSYSTEMS LLC
Reel/Frame 028931/0658 →
Continuity (3)
Continuation PCTUS2006045219 · Nov 22, 2006
Provisional Application 60738954 · Nov 22, 2005
Related Publication 20090127240A1 · May 21, 2009