IP Library Granted Patent US 7,679,918
Granted Patent B2
US 7,679,918 · App. 12/126,367 · Granted Mar 16, 2010

LED element and printed circuit board with the same

Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
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Quick Facts
Patent No.
US 7,679,918
App. No.
12/126,367
Granted
Mar 16, 2010
Kind
B2
Abstract

Disclosed is a printed circuit board (PCB) comprising at least one light emitting diode (LED) element and a PCB body. The LED comprises a heat sink, a light emitting body and two base feet, each base foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion, and the heat sink is disposed under the support portion. The PCB body comprises a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and two second recess portions for receiving the engaging portions of the base feet to increase heat dissipation of the base feet.

Claims (17)

1. A printed circuit board (PCB) comprising:

at least one light emitting diode (LED) element comprising a heat sink, a light emitting body, and two base feet, each base foot comprising a support portion for supporting the light emitting body, an engaging portion, and a connecting portion for connecting the support portion to the engaging portion, wherein the heat sink is disposed under the support portion; and

a PCB body comprising a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and two second recess portions for receiving the engaging portions of the base feet to increase heat dissipation of the base feet.

2. The PCB according to claim 1 , wherein a height of the heat sink is larger than a height of a connecting portion and the bottom surface of the heat sink is coplanar with a surface of the PCB body on which the LED element is mounted.

3. The PCB according to claim 1 , wherein the first recess portion is a through hole or a blind hole.

4. The PCB according to claim 1 , wherein the second recess portion is a through hole or a blind hole.

5. The PCB according to claim 1 , further comprising:

two heat dissipation foot, each heat dissipation foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion; and

two third recess portions on the PCB body for receiving the engaging portions of the heat dissipation feet to increase heat dissipation of the heat dissipation feet.

6. The PCB according to claim 5 , wherein a height of the heat sink is larger than a height of a connecting portion and the bottom surface of the heat sink is coplanar with a surface of the PCB body on which the LED element is mounted.

7. The PCB according to claim 5 , wherein the third recess portion is a through hole or a blind hole.

8. A printed circuit board (PCB) comprising

at least one light emitting diode (LED) element comprising a heat sink, a light emitting body and at least one foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion, wherein the heat sink is disposed under the support portion; and

a PCB body comprising a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and at least one second recess portion for receiving the engaging portion of the at least one foot to increase heat dissipation of the at least one foot.

9. The PCB according to claim 8 , wherein a height of the heat sink is larger than a height of a connecting portion and the bottom surface of the heat sink is coplanar with a surface of the PCB body on which the LED element is mounted.

10. The PCB according to claim 8 , wherein the first recess portion is a through hole or a blind hole.

11. The PCB according to claim 8 , wherein the second recess portion is a through hole or a blind hole.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
To: BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO. LTD
Reel/Frame 036644/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2008
From: KIM, JONGDAE
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 020993/0182 →
Priority Claims (1)
CN 2007 1 0122585 · Sep 27, 2007 · national
Continuity (1)
Related Publication 20090086438A1 · Apr 2, 2009