IP Library Granted Patent US 7,563,110
Granted Patent B2
US 7,563,110 · App. 12/126,702 · Granted Jul 21, 2009

Multiple wavelength sensor interconnect

Assignee: Masimo Laboratories, Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,563,110
App. No.
12/126,702
Granted
Jul 21, 2009
Kind
B2
Abstract

A sensor interconnect assembly has a circuit substrate. An emitter portion of the substrate is adapted to mount emitters. A detector portion of the substrate is adapted to mount a detector. A cable portion of the substrate is adapted to connect a sensor cable. A first group of conductors are disposed on the substrate electrically interconnecting the emitter portion and the cable portion. A second group of conductors are disposed on the substrate electrically interconnecting the detector portion and the cable portion. A decoupling portion of the substrate disposed proximate the cable portion substantially mechanically isolating the cable portion from both the emitter portion and the detector portion so that sensor cable stiffness is not translated to the emitters or the detector.

Claims (21)

1. A sensor interconnect method comprising:

providing a circuit substrate having an emitter mount, a detector mount and a cable connector;

electrically connecting sensor cable wires to the cable connector; and

decoupling the sensor cable wires from the emitter mount and the detector mount.

2. The sensor interconnect method according to claim 1 further comprising:

attaching and electrically connecting an emitter substrate to the emitter mount, the emitter substrate having a plurality of emitters.

3. The sensor interconnect method according to claim 2 further comprising:

forming a flexible bend between the emitter mount and the cable connector so as to decouple the emitter mount and the cable connector.

4. The sensor interconnect method according to claim 3 further comprising:

forming a flexible bend between the detector mount and the cable connector so as to decouple the detector mount and the cable connector.

5. The sensor interconnect method according to claim 4 further comprising folding a shield portion of the flex circuit over at least a portion of the sensor cable wires.

6. A sensor flex circuit comprising:

an emitter end;

a detector end,

an elongated interconnect between the emitter end and the detector end; and

a cable connector extending from the interconnect,

wherein the emitter end has emitter pads for physically attaching and electrically connecting an emitter assembly.

7. The sensor flex circuit according to claim 6 further comprising mounting ears extending from the emitting end for attaching to a finger clip pad.

8. The sensor flex circuit according to claim 7 wherein the cable connector comprises wings that extend from each side of the interconnect, the wings having a relatively large solder pad area for cable attachment and a narrowed area for mechanically isolating a cable from the remainder of the flex circuit.

9. The sensor flex circuit according to claim 8 further comprising a neck adapted to be bent so as to form a flexible spring within a finger clip,

wherein the flexible spring is adapted to mechanically isolate the cable from the emitter assembly.

Assignments (2)
CHANGE OF NAME Recorded May 16, 2024
From: CERCACOR LABORATORIES, INC.
To: WILLOW LABORATORIES, INC.
Reel/Frame 067455/0298 →
CHANGE OF NAME Recorded May 21, 2012
From: MASIMO LABORATORIES, INC.
To: CERCACOR LABORATORIES, INC.
Reel/Frame 028246/0087 →
Continuity (6)
Continuation 1136621000 · Mar 1, 2006
Provisional Application 6065759600 · Mar 1, 2005
Provisional Application 6065728100 · Mar 1, 2005
Provisional Application 6065726800 · Mar 1, 2005
Provisional Application 6065775900 · Mar 1, 2005
Related Publication 20080220633A1 · Sep 11, 2008