Granted Patent B2

US 7,876,564 · App. 12/127,133 · Granted Jan 25, 2011

Abstract

Claims (31)

1. A cooling apparatus for a computer memory module comprising a substrate with memory chips on at least one surface thereof, at least one of the memory chips having a maximum preselected operating temperature, the cooling apparatus comprising:

a primary heat spreader having a longitudinal extent and comprising separate and discrete first and second panels configured to engage the memory module therebetween by assembling and securing the first and second panels together, the first and second panels having contact surfaces that face each other when the first and second panels are assembled and secured together and are adapted for thermal contact with the at least one memory chip of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween;

at least a first heatpipe fluidically coupled to the first panel of the primary heat spreader and having a remote portion alongside the first panel so as to be oriented substantially parallel to and spaced apart from the primary heat spreader in a lateral direction relative to the longitudinal extent of the primary heat spreader;

a secondary heat spreader in thermally conductive contact with the remote portion of the first heatpipe and spaced apart from the primary heat spreader so as to define an air gap therebetween, the secondary heat spreader comprising means for increasing surface dissipation of heat from the first heatpipe into the environment; and

a coolant within the first heatpipe and within the primary heat spreader so as to absorb heat from the primary heat spreader while the coolant is within the first panel and conduct the absorbed heat to the secondary heat spreader by flowing from the first panel through the first heatpipe to the remote portion thereof, the coolant having a boiling point at or below the maximum preselected operating temperature of the at least one memory chip;

wherein the first heatpipe is fluidically coupled to a fluid-tight passage within the first panel of the primary heat spreader, and the passage has a wall that defines at least a portion of the contact surface of the first panel and thermally contacts the at least one memory chip of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween; and

wherein the wall of the passage is a plate bonded to the first panel so as to close the passage and has a flat surface that defines the portion of the contact surface of the first panel.

2. The cooling apparatus according to claim 1 , wherein the primary and secondary heat spreaders are formed of at least one material chosen from the group consisting of copper, aluminum, beryllium oxide, and thermally conductive carbon.

3. The cooling apparatus according to claim 1 , wherein the first panel and the remote portion of the first heatpipe define a structure that is substantially U-shaped.

4. The cooling apparatus according to claim 1 , wherein the surface dissipation means of the secondary heat spreader comprises fins oriented transverse to the remote portion of the first heatpipe.

5. The cooling apparatus according to claim 1 , wherein the first heatpipe is rotatably attached to the first panel of the primary heat spreader.

6. The cooling apparatus according to claim 1 , further comprising at least a second heatpipe coupled to the second panel of the primary heat spreader and having a remote portion alongside the second panel so as to be substantially parallel to and laterally spaced apart a substantially uniform distance from the primary heat spreader.

7. The cooling apparatus according to claim 6 , further comprising a second secondary heat spreader in thermally conductive contact with the remote portion of the second heatpipe and spaced apart from the primary heat spreader so as to define an air gap therebetween, the second secondary heat spreader comprising means for increasing surface dissipation of heat from the second heatpipe into the environment.

8. The cooling apparatus according to claim 1 , wherein the first and second panels are assembled and secured together and the cooling apparatus is installed on the memory module so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

9. A method of cooling a computer memory module, the method comprising installing the cooling apparatus of claim 1 on the memory module by assembling and securing the first and second panels together so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

10. A cooling apparatus for a computer memory module comprising a substrate with memory chips on at least one surface thereof, at least one of the memory chips having a maximum preselected operating temperature, the cooling apparatus comprising:

a primary heat spreader having a longitudinal extent and comprising separate and discrete first and second panels configured to engage the memory module therebetween by assembling and securing the first and second panels together, the first and second panels having contact surfaces that face each other when the first and second panels are assembled and secured together and are adapted for thermal contact with the at least one memory chip of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween;

at least a first heatpipe fluidically coupled to the first panel of the primary heat spreader and having a remote portion alongside the first panel so as to be oriented substantially parallel to and spaced apart from the primary heat spreader in a lateral direction relative to the longitudinal extent of the primary heat spreader;

a secondary heat spreader in thermally conductive contact with the remote portion of the first heatpipe and spaced apart from the primary heat spreader so as to define an air gap therebetween, the secondary heat spreader comprising means for increasing surface dissipation of heat from the first heatpipe into the environment; and

a coolant within the first heatpipe and within the primary heat spreader so as to absorb heat from the primary heat spreader while the coolant is within the first panel and conduct the absorbed heat to the secondary heat spreader by flowing from the first panel through the first heatpipe to the remote portion thereof, the coolant having a boiling point at or below the maximum preselected operating temperature of the at least one memory chip;

wherein a second portion of the first heatpipe is received within a groove recessed in the contact surface of the first panel, and a flat wall of the second portion of the first heatpipe is flush with the contact surface of the first panel and thermally contacts the at least one memory chip of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween.

11. The cooling apparatus according to claim 10 , wherein the first and second panels are assembled and secured together and the cooling apparatus is installed on the memory module so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

12. A method of cooling a computer memory module, the method comprising installing the cooling apparatus of claim 10 on the memory module by assembling and securing the first and second panels together so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

13. A cooling apparatus for a computer memory module comprising a substrate with memory chips on at least one surface thereof, at least one of the memory chips having a maximum preselected operating temperature, the cooling apparatus comprising:

a primary heat spreader having a longitudinal extent and comprising separate and discrete first and second panels configured to engage the memory module therebetween by assembling and securing the first and second panels together, the first and second panels having contact surfaces that face each other when the first and second panels are assembled and secured together and are adapted for thermal contact with the at least one memory chip of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween;

at least a first heatpipe fluidically coupled to the first panel of the primary heat spreader and having a remote portion alongside the first panel so as to be oriented substantially parallel to and spaced apart from the primary heat spreader in a lateral direction relative to the longitudinal extent of the primary heat spreader;

a secondary heat spreader in thermally conductive contact with the remote portion of the first heatpipe and spaced apart from the primary heat spreader so as to define an air gap therebetween, the secondary heat spreader comprising means for increasing surface dissipation of heat from the first heatpipe into the environment; and

a coolant within the first heatpipe and within the primary heat spreader so as to absorb heat from the primary heat spreader while the coolant is within the first panel and conduct the absorbed heat to the secondary heat spreader by flowing from the first panel through the first heatpipe to the remote portion thereof, the coolant having a boiling point at or below the maximum preselected operating temperature of the at least one memory chip;

wherein a second portion of the first heatpipe is received within a bore within the first panel, and the bore is not located at or beneath the contact surface of the first panel so that the second portion of the first heatpipe is adjacent and parallel to an edge of the computer memory module when the first and second panels are assembled and secured together with the computer memory module therebetween.

14. The cooling apparatus according to claim 13 , wherein the first and second panels are assembled and secured together and the cooling apparatus is installed on the memory module so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

15. A method of cooling a computer memory module, the method comprising installing the cooling apparatus of claim 13 on the memory module by assembling and securing the first and second panels together so that the memory module and the chips thereof are between the contact surfaces of the first and second panels and at least one of the chips is contacted by at least one of the contact surfaces.

Assignments (15)