Optical subassembly for an electro-optical assembly
View Patent ↗Various embodiments of optical subassemblies, and arrangements and methods for manufacturing same, for an electro-optical assembly are disclosed. One embodiment comprises an optical subassembly for an electro-optical assembly. The optical subassembly comprises a printed circuit board, an optical semiconductor device, and an optical element. The printed circuit board has a first surface, a second surface, and an aperture therethrough. The optical semiconductor device is attached to the first surface with an active region exposed to the aperture. The optical element is attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region.
1. An optical subassembly for an electro-optical assembly, the optical subassembly comprising:
a printed circuit board defining a planar structure having a first surface and a second surface opposing each other, and an aperture extending between the first and second surfaces;
an optical semiconductor device attached to the first surface with an active region exposed to the aperture;
an optical element attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region of the optical semiconductor device attached to the first surface;
an enclosure at least partially encapsulating the optical element, the enclosure having a port optically aligned with the optical axis of the optical element and adapted to receive a fiber ferrule.
2. The optical subassembly of claim 1 , wherein the optical semiconductor device comprises a light source.
3. The optical subassembly of claim 2 , wherein the light source comprises one of a light emitting diode (LED) or a laser diode.
4. The optical subassembly of claim 1 , wherein the optical semiconductor device comprises a photodiode.
5. The optical subassembly of claim 1 , wherein the active region and corresponding electrical contacts are located on a same surface of the optical semiconductor device.
6. The optical subassembly of claim 5 , wherein the printed circuit board comprises a pair of contact pads for connecting to the corresponding electrical contacts.
7. The optical subassembly of claim 1 , wherein the printed circuit board comprises at least one through-hole for connecting to an electronic subassembly.