IP Library Granted Patent US 7,732,891
Granted Patent B2
US 7,732,891 · App. 12/132,181 · Granted Jun 8, 2010

Semiconductor device

Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 7,732,891
App. No.
12/132,181
Granted
Jun 8, 2010
Kind
B2
Abstract

A semiconductor device has a substrate, a source region formed on the surface portion of the substrate, a first insulating layer formed on the substrate, a gate electrode formed on the first insulating layer, a second insulating layer formed on the gate electrode, a body section connected with the source region, penetrating through the first insulating layer, the gate electrode and the second insulating layer, and containing a void, a gate insulating film surrounding the body section, and formed between the body section and the gate electrode, and a drain region connected with the body section.

Claims (10)

1. A semiconductor device comprising:

a source region surrounded by a first insulating film;

a second insulating film formed on the first insulating film and the source region;

a plurality of third insulating films and gate electrodes alternately laminated on the second insulating film;

a body section connected with the source region, penetrating through the plurality of third insulating films, gate electrodes and the second insulating film, and containing a void;

a fourth insulating film surrounding the body section, having a charge accumulating ability formed between the body section and the gate electrode; and

a drain region formed on the body section.

2. The semiconductor device according to claim 1 , wherein the diameter of the body section on the third insulating film portion is larger than the diameter on the gate electrode portion.

3. The semiconductor device according to claim 1 , wherein the diameter of the body section on the gate electrode portion is larger than the diameter on the third insulating film portion.

4. The semiconductor device according to claim 1 , wherein the void is filled with an insulating film.

Assignments (5)
MERGER Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: K.K. PANGEA
Reel/Frame 055659/0471 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 055669/0001 →
CHANGE OF NAME AND ADDRESS Recorded Jan 22, 2021
From: K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 055669/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2008
From: TANAKA, HIROYASU; AOCHI, HIDEAKI; KATSUMATA, RYOTA; KIDOH, MASARU; FUKUZUMI, YOSHIAKI; KITO, MASARU; MATSUOKA, YASUYUKI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 021329/0285 →
Continuity (1)
Related Publication 20090294844A1 · Dec 3, 2009