A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device is provided. The sensor comprises a substrate, at least one electrically conductive support member connected to the substrate, and a thermally resistive layer supported by the at least one support member and spaced from the substrate by the support member to provide a space between the thermally resistive layer and the substrate. The sensor is arranged such that the thermally resistive layer is substantially thermally insulated from the substrate. The sensor is further arranged to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.
1. A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device, the sensor comprising:
a semiconductor substrate;
at least one electrically conductive support member connected to the semiconductor substrate; and
a thermally resistive layer supported by the at least one electrically conductive support member and spaced from the semiconductor substrate by the at least one electrically conductive support member to provide a space between the thermally resistive layer and the semiconductor substrate, the sensor being arranged such that the thermally resistive layer is substantially thermally insulated from the semiconductor substrate, wherein the sensor is configured to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor.
2. The micro mechanical vacuum sensor according to claim 1 , wherein the thermally resistive layer is heated by resistive heating.
3. The micro mechanical vacuum sensor according to claim 1 , wherein the thermally resistive layer comprises platinum (Pt), titanium (Ti), or SiGe single crystal thermistor material.
4. The micro mechanical vacuum sensor according to claim 1 , further comprising: an electrically conductive component arranged to electrically connect the at least one electrically conductive support member to the semiconductor substrate.
5. The micro mechanical vacuum sensor according to claim 1 , wherein the thermally resistive layer is supported by at least one electrically insulating layer.
6. The micro mechanical vacuum sensor according to claim 5 , wherein the at least one electrically insulating layer comprises silicon nitride (SiN) or silicon dioxide (SiO 2 ).
7. The micro mechanical vacuum sensor according to claim 5 , wherein the thermally resistive layer is buried in the at least one electrically insulating layer.
8. The micro mechanical vacuum sensor according to claim 1 , further comprising: an electrical connector arranged to connect the thermally resistive layer to the at least one electrically conductive support member.
9. The micro mechanical vacuum sensor according to claim 1 , further comprising a getter material arranged over the thermally resistive layer.
10. The micro mechanical vacuum sensor according to claim 9 , wherein the getter material comprises titanium (Ti).
11. The micro mechanical vacuum sensor according to any claim 1 , wherein the semiconductor substrate comprises at least one of silicon, ceramic, and glass.
12. The micro mechanical vacuum sensor according to claim 1 , further comprising: a seal-ring and a covering that are connected to the semiconductor substrate, such that the thermally resistive layer is sealed in a cavity.
13. The micro mechanical vacuum sensor of claim 1 , wherein the thermally resistive layer is spaced from the semiconductor substrate by a distance that is substantially equal to a height of the at least one electrically conductive support member.
14. The micro mechanical vacuum sensor of claim 1 , wherein the at least one electrically conductive member comprise a base having a width that is greater than a width of a remainder of the at least one electrically conductive support member.
15. The micro mechanical vacuum sensor of claim 1 , further comprising:
a thin-film electrically conductive layer disposed above the semiconductor substrate;
a diffusion barrier material layer disposed between the thin-film electrically conductive layer and the at least one electrically conductive support member; and
a passivation layer disposed between the thin-film electrically conductive layer and the semiconductor substrate.
16. An infrared bolometer device, comprising:
a semiconductor substrate;
a vacuum sensor comprising:
at least one electrically conductive support member connected to the semiconductor substrate;
a thermally resistive layer supported by the at least one electrically conductive support member and spaced from the semiconductor substrate by the at least one electrically conductive support member to provide a space between the thermally resistive layer and the semiconductor substrate, the sensor being arranged such that the thermally resistive layer is substantially thermally insulated from the semiconductor substrate, wherein the sensor is configured to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor; and
one or more bolometer devices disposed on the semiconductor substrate and configured to detect infrared radiation.
17. The infrared bolometer device according to claim 16 , further comprising a plurality of infrared bolometer detector pixels.
18. A micro mechanical vacuum sensor for determining the pressure within a cavity of a micro mechanical device, the sensor comprising:
a substrate;
at least one electrically conductive support member connected to the substrate;
a thermally resistive layer supported by the at least one electrically conductive support member and spaced from the substrate by the at least one electrically conductive support member to provide a space between the thermally resistive layer and the substrate, the sensor being arranged such that the thermally resistive layer is substantially thermally insulated from the substrate, wherein the sensor is configured to be driven such that the pressure within the cavity is determined by a temperature value sensed by the sensor; and
a seal-ring and a covering that are connected to the substrate and which enclose the cavity, such that the thermally resistive layer is sealed in the cavity.