Method for inspecting semiconductor device
View Patent ↗A method for inspecting a semiconductor device includes carrying out a first test for inspecting characteristics of semiconductor devices under a shielded (dark) condition to discriminate non-defective devices; and carrying out a second test on the semiconductor devices which have passed the first test as non-defective devices, for inspecting characteristics of the semiconductor devices. The second test is carried out while a predetermined color of light is applied to the semiconductor devices.
1. A method for inspecting a semiconductor device comprising:
carrying out a first test for inspecting characteristics of semiconductor devices under a shielded (dark) condition to discriminate non-defective devices; and
carrying out a second test on the semiconductor devices which have passed the first test as non-defective devices, for inspecting characteristics of the semiconductor devices,
wherein the second test is carried out while a predetermined color of light is applied to the semiconductor devices, and the second test is carried out after the first test.
2. A method for inspecting a semiconductor device according to claim 1 , wherein said semiconductor devices to be inspected are LSIs for a LCD panel.
3. A method for fabricating a semiconductor device comprising:
forming a plurality of semiconductor devices on a wafer;
carrying out a first test for inspecting characteristics of the semiconductor devices under a shielded (dark) condition to discriminate non-defective devices; and
carrying out a second test on the semiconductor devices which have passed the first test as non-defective devices, for inspecting characteristics of the semiconductor devices,
wherein the second test is carried out while a predetermined color of light is applied to the semiconductor devices, and the second test is carried out after the first test.
4. A method for fabricating a semiconductor device according to claim 3 , further comprising:
after the second test, dicing the wafer to divide the semiconductor devices from each other; and
discriminating the semiconductor devices that have passed both the first and second tests.
5. A method for fabricating a semiconductor device according to claim 3 , wherein said semiconductor devices to be inspected are LSIs for a LCD panel.