LED package with stepped aperture
View Patent ↗A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. Optionally, the LED die may be mounted directly on a base metal layer. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed. The LED package is advantageously laminated together using a pre-punched pre-preg material or a pressure sensitive adhesive.
1. A LED package comprising:
a metal base;
a PWB assembly comprising first and second PWB layers, the first PWB layer having a first top metal layer, a first bottom metal layer, and a first dielectric layer disposed between the first top metal layer and the first bottom metal layer, and the second PWB layer having a second top metal layer, a second bottom metal layer, and a second dielectric layer disposed between the second top metal layer and the second bottom metal layer, the first and second PWB layers defining a plurality of stepped apertures, and the second dielectric layer having a thickness greater than a thickness of the first dielectric layer, wherein the PWB assembly overlies the metal base; one or more isolators disposed in at least one of the plurality of stepped apertures of the PWB assembly and mounted on the metal base; and
one or more LED die mounted on at least one of the one or more isolators.
2. The LED package of claim 1 , wherein the one or more isolators are composed of a material having a TCE approximately equal to the TCE of the one or more LED die.
3. The LED package of claim 1 , further comprising an optical element disposed over the one or more LED die.
4. A LED package comprising:
a metal base;
a PWB assembly comprising first and second PWB layers, the first PWB layer having a first top metal layer, a first bottom metal layer, and a first dielectric layer disposed between the first top metal layer and the first bottom metal layer, and the second PWB layer having a second top metal layer, a second bottom metal layer, and a second dielectric layer disposed between the second top metal layer and the second bottom metal layer, the first and second PWB layers defining a plurality of stepped apertures, and the second dielectric layer having a thickness greater than a thickness of the first dielectric layer, wherein the PWB assembly overlies the metal base; and
one or more LED die mounted on the metal base, wherein the metal base is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.
5. A LED package comprising:
a multi-layer assembly including a PWB assembly, an insulating layer, and a metal base laminated together by a laminate material, the PWB assembly and the insulating layer defining a stepped cavity;
the PWB assembly having first and second PWB layers, the first PWB layer having a first top metal layer, a first bottom metal layer, and a first dielectric layer disposed between the first top metal layer and the first bottom metal layer, and the second PWB layer having a second top metal layer, a second bottom metal layer, and a second dielectric layer disposed between the second top metal layer and the second bottom metal layer, and the second dielectric layer having a thickness greater than a thickness of the first dielectric layer; and
one or more LED die disposed in the stepped cavity.
6. The LED package of claim 5 , wherein the PWB assembly comprises one or more vias.
7. The LED package of claim 6 , wherein the one or more vias are electrically insulated from the metal base by the insulating layer.
8. The LED package of claim 5 , wherein the laminate material comprises a pressure sensitive adhesive.
9. The LED package of claim 5 , wherein the laminate material comprises a pre-preg material.
10. The LED package of claim 9 , wherein the pre-preg material includes an aperture aligned with the stepped cavity.
11. The LED package of claim 5 , wherein the one or more LED die are disposed on the metal base.
12. The LED package of claim 11 , wherein the metal base is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.
13. The LED package of claim 5 wherein the one or more LED die are mounted on an isolator disposed on the metal base.
14. The LED package of claim 13 , wherein the isolator is composed of a material having a TCE approximately equal to the TCE of the one or more LED die.
15. The LED package of claim 5 , wherein the insulating layer comprises a fiberglass reinforced material.
16. The LED package of claim 5 , wherein the insulating layer comprises one or more layers of laminate material.
17. The LED package of claim 16 , wherein the one or more layers of laminate material comprise a pre-punched pre-preg material.
18. The LED package of claim 17 , wherein the one or more layers of laminate material comprise a pressure sensitive adhesive.