IP Library Granted Patent US 8,946,764
Granted Patent B2
US 8,946,764 · App. 12/138,250 · Granted Feb 3, 2015

Gallium nitride-based semiconductor element, optical device using the same, and image display apparatus using optical device

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Quick Facts
Patent No.
US 8,946,764
App. No.
12/138,250
Granted
Feb 3, 2015
Kind
B2
Abstract

A GaN-based semiconductor element which can suppress a leakage current generated during reverse bias application, an optical device using the same, and an image display apparatus using the optical device are provided. The GaN-based semiconductor element has a first GaN-based compound layer including an n-type conductive layer; a second GaN-based compound layer including a p-type conductive layer; and an active layer provided between the first GaN-based compound layer and the second GaN-based compound layer. In this GaN-based semiconductor element, the first GaN-based compound layer includes an underlayer having an n-type impurity concentration in the range of 3×10 18 to 3×10 19 /cm 3 , and when a reverse bias of 5 V is applied, a leakage current density, which is the density of a current flowing per unit area of the active layer, is 2×10 −5 A/cm 2 or less.

Claims (26)

1. A gallium nitride-based semiconductor element comprising:

a first GaN-based compound layer comprising:

a first undoped GaN layer,

an n-type conductive first GaN-based compound semiconductor layer formed on the undoped GaN layer,

an underlayer formed directly on the n-type conductive first GaN-based compound semiconductor layer, and

a second undoped GaN layer formed directly on the underlayer;

an active layer formed on the second undoped GaN layer; and

a second GaN-based compound layer including a p-type conductive layer formed on the active layer such that the active layer is provided between the first GaN-based compound layer and the second GaN-based compound layer,

wherein the underlayer has an n-type impurity concentration in the range of 3×10 18 to 3×10 19 /cm 3 , and when a reverse bias of 5 V is applied, a leakage current density, which is the density of a current flowing per unit area of the active layer, is 2×10 −5 A/cm 2 or less.

2. The gallium nitride-based semiconductor element according to claim 1 , wherein the n-type impurity concentration of the underlayer is 4×10 18 /cm 3 or more, and the leakage current density is 8×10 −6 A/cm 2 or less.

3. The gallium nitride-based semiconductor element according to claim 1 , wherein the n-type impurity concentration of the underlayer is 8×10 18 /cm 3 or more, and the leakage current density is 1×10 −6 A/cm 2 or less.

4. The gallium nitride-based semiconductor element according to claim 1 , wherein the n-type impurity concentration of the underlayer is 1×10 19 /cm 3 or more, and the leakage current density is 6×10 −7 A/cm 2 or less.

5. The gallium nitride-based semiconductor element according to claim 1 , wherein the underlayer and the active layer each include a GaN-based compound containing In, the atomic composition ratio of In to the sum of In and Ga (In +Ga) in the GaN-based compound forming the underlayer is 0.005 or more and is lower than that of the GaN-based compound forming the active layer.

6. The gallium nitride-based semiconductor element according to claim 1 , wherein the underlayer has a thickness in the range of 5 nm to 5 μm.

7. The gallium nitride-based semiconductor element according to claim 1 , wherein the underlayer has a thickness in the range of 20 nm to 1 μm.

8. The gallium nitride-based semiconductor element according to claim 1 , wherein the second GaN-based compound layer includes a GaN layer doped with a p-type impurity and having a thickness of 100 nm or more.

9. The gallium nitride-based semiconductor element according to claim 1 , wherein the gallium nitride-based semiconductor element is a light-emitting element.

10. An optical device comprising:

a plurality of gallium nitride-based semiconductor elements, each of which is the gallium nitride-based semiconductor element according to claim 1 , arranged in a two-dimensional matrix,

wherein first electrodes of the gallium nitride-based semiconductor elements disposed along lines in a first direction are connected to common wires of the respective lines in the first direction, and

second electrodes of the gallium nitride-based semiconductor elements disposed along lines in a second direction are connected to common wires of the respective lines in the second direction.

11. An image display apparatus comprising:

a pixel portion including the optical device according to claim 10 ,

wherein the gallium nitride-based semiconductor elements are passive matrix driven.

12. The gallium nitride-based semiconductor element according to claim 1 , wherein the layers forming the first GaN-based compound layer and the second GaN-based compound layer are transparent to emission light wavelengths.

13. The gallium nitride-based semiconductor element according to claim 1 , wherein the n-type conductive first GaN-based compound semiconductor layer forms a contact with an n-type electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2008
From: BIWA, GOSHI; NISHINAKA, IPPEI; OKUYAMA, HIROYUKI
To: SONY CORPORATION
Reel/Frame 021102/0309 →