IP Library Granted Patent US 7,764,146
Granted Patent B2
US 7,764,146 · App. 12/139,121 · Granted Jul 27, 2010

Cavity microwave filter assembly with lossy networks

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Quick Facts
Patent No.
US 7,764,146
App. No.
12/139,121
Granted
Jul 27, 2010
Kind
B2
Abstract

A cavity microwave filter assembly for filtering an electromagnetic wave including a plurality of cavity resonator assemblies, where each cavity resonator assembly has a bottom and including at least one lossy element for electromagnetically coupling two elements of the filter assembly, where at least one element is a cavity resonator assembly. The lossy elements provide attenuation in the loss variation of the filter and sharper slopes resulting in an improved Q factor for the filter. A method for realizing lossy elements as resistors requires determining an equivalent circuit model that can be manufactured using resistors, coupling elements, and transmission lines. The method includes representing the resistive element with a resistor, unity admittance inverters and coupling elements and then scaling to determine the resistor and coupling values. The method further includes replacing the admittance inverters with transmission lines of the appropriate length to account for the specific design of the filter.

Claims (27)

1. A cavity microwave filter assembly for filtering an electromagnetic wave, said cavity microwave filter assembly having at least two representative nodes and comprising:

(a) a plurality of cavity resonator assemblies, each said cavity resonator assembly having a resonator cavity and an underside and being represented by a node; and

(b) at least one lossy element inserted into the cavity microwave filter assembly between two nodes, wherein the at least one lossy element improves the frequency response of the cavity microwave filter assembly by improving the loss variation in the passband and increasing the sharpness at the band edges, wherein at least one of the nodes represents a cavity resonator assembly.

2. The cavity microwave filter assembly of claim 1 , wherein the resonator assemblies are single mode or dual-mode resonator assemblies and wherein the resonator assemblies are selected from the group consisting of cavity, combline, and dielectric resonator assembly types.

3. The cavity microwave filter assembly of claim 2 , wherein at least two resonator assemblies are different resonator assembly types.

4. The cavity microwave filter assembly of claim 1 , wherein each of the plurality of cavity resonator assemblies have substantially similar Q factors.

5. The cavity microwave filter assembly of claim 1 , wherein the at least one lossy element is a dissipative resonator with a different Q factor than at least one of the cavity resonator assemblies.

6. The cavity microwave filter assembly of claim 1 , wherein the resonator assemblies further include lossy material positioned inside the resonator cavity.

7. The cavity microwave filter assembly of claim 1 , wherein the lossy element comprises lossy material between two nodes.

8. The cavity microwave filter assembly of claim 6 or 7 , wherein the lossy material is selected from the group consisting of dielectrics, ferrites, and conductors.

9. The cavity microwave filter assembly of claim 1 , wherein the at least one lossy element comprises a complex coupling element comprising both real and resistive coupling in parallel between at least two nodes in the cavity microwave filter assembly.

10. The cavity microwave filter assembly of claim 1 , wherein the at least one lossy element comprises at least one planar component selected from the group consisting of transistors, capacitors, inductors, diodes, amplifiers, mixers, switches, surface mount resistors, electro-deposited lossy type material.

11. The cavity microwave filter assembly of claim 10 , wherein the at least one planar component is manufactured using a technology selected from the group consisting of discrete form, RFIC, MMIC, MEMS, and RF MEMS technology.

12. The cavity microwave filter assembly of claim 1 , wherein the at least one lossy element is between two nodes of the cavity microwave filter assembly along the underside of at least one cavity resonator assembly using a through hole.

13. The cavity microwave filter assembly of claim 1 , further comprising at least one planar resonator assembly.

14. The cavity microwave filter assembly of claim 13 , wherein the at least one planar resonator assembly is implemented by microstrip technology or stripline technology.

15. The microwave filter assembly of claim 13 , wherein the at least one planar resonator assembly is attached to the underside of at least one cavity resonator assembly using a through hole.

16. The microwave filter assembly of claim 12 or 15 , wherein the through holes are filled with a dielectric material to improve mechanical stability.

17. The microwave filter assembly of claim 1 , further comprising at least one input connection and at least one output connection, wherein each of the input and output connections are directly coupled to one of the resonator assemblies or to the at least one lossy element.

18. The microwave filter assembly of claim 1 , wherein the resulting filter assembly has different loss levels for input return loss (S 11 ) and output return loss (S 22 ).

19. The microwave filter assembly of claim 18 , wherein the input return loss and the output return loss can be independently varied.

20. A method for realizing the connection of a resistive element to at least one resonator within a representative node diagram by a physical circuit, the method comprising:

a. representing the resistive element using a representation of a circuit model, said circuit model comprising a resistor, a plurality of admittance inverters;

b. scaling the representative circuit model of the resistive element to obtain a desired resistor value and desired value of a coupling element, wherein a coupling element is analogous to an admittance inverter; and

c. transforming the plurality of admittance inverters into a plurality of transmission lines and determining the physical transmission line lengths.

21. The method in claim 20 , wherein the plurality of transmission lines comprise planar technology.

22. The method in claim 20 , further comprising using network transforms to achieve different representative circuit model configurations.

Assignments (3)
MERGER AND CHANGE OF NAME Recorded Oct 28, 2022
From: COM DEV LTD.; HONEYWELL LIMITED HONEYWELL LIMITÉE
To: HONEYWELL LIMITED HONEYWELL LIMITÉE
Reel/Frame 061800/0202 →
MERGER AND CHANGE OF NAME Recorded Feb 1, 2018
From: COM DEV INTERNATIONAL LTD.; COM DEV LTD.; COM DEV ATLANTIC LTD.; COM DEV LTD.
To: COM DEV LTD.
Reel/Frame 044801/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2008
From: YU, MING; MIRAFTAB, S. VAHID
To: COM DEV INTERNATIONAL LTD.
Reel/Frame 021442/0658 →