IP Library Granted Patent US 7,806,502
Granted Patent B2
US 7,806,502 · App. 12/140,264 · Granted Oct 5, 2010

Printer arrangement with printhead and ink transport assembly

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Quick Facts
Patent No.
US 7,806,502
App. No.
12/140,264
Granted
Oct 5, 2010
Kind
B2
Abstract

A printer arrangement having a printhead mounted on a carrier, the printhead connected to a printhead controller by means of encapsulated wire bonds. The arrangement also includes an ink supply manifold having a plurality of ink reservoirs for supplying the printhead with ink, and an ink transport assembly configured to facilitate purging of ink from the printhead when the assembly is in a cleaning position.

Claims (12)

1. A printer arrangement comprising:

a printhead mounted on a carrier, the printhead connected to a printhead controller by means of encapsulated wire bonds;

an ink supply manifold having a plurality of ink reservoirs for supplying the printhead with ink;

an ink transport assembly configured to facilitate purging of ink from the printhead when the assembly in a cleaning position;

a drive motor;

a number of rollers of which at least one is operatively actuated by the drive motor; and

a film wound in a loop around said rollers, so that actuation of the rollers by the motor produces a laminar ink flow in a cavity defined by the film, the printhead and the encapsulated wire bonds when the assembly is in the cleaning position.

2. The printer arrangement of claim 1 , which includes a displacement mechanism for displacing the ink transport assembly between a printing position and the cleaning position.

3. The printer arrangement of claim 1 , wherein the film is arranged in sealing contact with a surface of the encapsulant, which acts as film guide in the cleaning position.

4. The printer arrangement of claim 1 , wherein the ink transport assembly includes an absorbent foam pad for cleaning a portion of the film before such portion re-enters the cavity.

5. The printer arrangement of claim 1 , wherein the printhead includes bonding pads from which the encapsulated wires extends, the wire bonds connecting drive circuitry in the printhead to a microprocessor which controls operation of the printhead.

6. The printer arrangement of claim 1 , wherein the encapsulant is a polymeric material.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028514/0775 →