IP Library Granted Patent US 7,838,576
Granted Patent B2
US 7,838,576 · App. 12/140,888 · Granted Nov 23, 2010

Poly (phenylene ether) resin composition, prepreg, and laminated sheet

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Quick Facts
Patent No.
US 7,838,576
App. No.
12/140,888
Granted
Nov 23, 2010
Kind
B2
Abstract

An object of the invention is to provide a poly(phenylene ether) resin composition that allows production of laminated sheets excellent in heat resistance and processability, even in case of using a low molecular weight PPE for convenience in prepreg manufacturing without the sacrifice of dielectric characteristics. The poly(phenylene ether) resin composition according to the present invention comprises poly(phenylene ether) and a crosslinking curing agent, wherein the poly(phenylene ether) is represented by the following formula (I) and the number averaged molecular weight thereof is in the range of 1,000 to 7,000. [wherein, X is an aryl group; (Y) m is a poly(phenylene ether) moiety; Z is a phenylene group and the like; R 1 to R 3 each independently is a hydrogen atom, and the like; n is an integer of 1 to 6; and q is an integer of 1 to 4.]

Claims (23)

1. A poly(phenylene ether) resin composition comprising a poly(phenylene ether) and a crosslinking curing agent containing trialkenyl isocyanurate, wherein:

said polyphenylene ether is represented by the following formula (I), and the number averaged molecular weight thereof is in a range of 1,000 to 7,000;

[wherein, X is an aryl group; (Y) m is a polyphenylene ether moiety; m is an integer of 1 to 100; R 1 to R 3 each independently is a hydrogen atom, an alkyl group, an alkenyl group or alkynyl group; n is an integer of 1 to 6; and q is an integer of 1 to 4] and

a mass ratio represented by [the poly(phenylene ether)]/(the crosslinking curing agent) is 60/40 to 90/10.

2. The poly(phenylene ether) resin composition according to claim 1 , wherein n is 1.

3. The poly(phenylene ether) resin composition according to claim 1 , wherein (Y) m is represented by the following formula (II)

wherein, R 4 to R 7 each independently is a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group or an alkenyl carbonyl group; and m is an integer of 1 to 100.

4. The poly(phenylene ether) resin composition according to claim 1 , wherein the portion represented by the following formula is selected from p-ethenylbenzyl and m-ethenylbenzyl groups.

5. The poly(phenylene ether) resin composition according to claim 1 , further comprising a poly(phenylene ether) having a number averaged molecular weight in a range of 9,000 to 18,000.

6. The poly(phenylene ether) resin composition according to claim 3 , further comprising a poly(phenylene ether) having a number averaged molecular weight in a range of 9,000 to 18,000.

7. The poly(phenylene ether) resin composition according to claim 4 , further comprising a poly(phenylene ether) having a number averaged molecular weight in a range of 9,000 to 18,000.

8. The poly(phenylene ether) resin composition according to claim 1 , wherein both p-ethenylbenzyl and m-ethenylbenzyl groups are present.

9. The poly(phenylene ether) resin composition according to claim 1 , wherein said crosslinking curing agent further contains a tri- to penta-functional (meth)acrylate compound.

10. The poly(phenylene ether) resin composition according to claim 1 , further comprising at least one kind of organic or inorganic filler.

11. The poly(phenylene ether) resin composition according to claim 10 , wherein said filler has an average diameter of 10 μm or less.

12. The poly(phenylene ether) resin composition according to claim 10 , wherein said filler is a hollow substance.

13. The poly(phenylene ether) resin composition according to claim 10 , wherein said filler is a substance prepared from a fluorine-containing compound.

14. The poly(phenylene ether) resin composition according to claim 1 , further comprising a flame retardant.

15. The poly(phenylene ether) resin composition according to claim 14 , wherein said flame retardant is a bromine compound having a bromine content of 8 to 20 mass % with respect to the total amount of the composition.

16. A prepreg prepared by impregnating the poly(phenylene ether) resin composition according to claim 1 into a substrate and semi-curing the resulting impregnated substrate.

17. The prepreg according to claim 16 , wherein said substrate is an NE-type glass cloth.

18. A laminated sheet prepared by piling the prepreg according to claim 16 and copper foil(s) one over the other under heat-pressing.

19. The laminated sheet according to claim 18 , wherein said copper foil has a surface roughness of 2 μm or less, and the surface thereof facing the prepreg is treated with zinc or a zinc alloy and at the same time coupled with a silane coupling agent having a vinyl group.

Assignments (2)
MERGER Recorded Oct 2, 2018
From: PANASONIC ELECTRIC WORKS CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 047038/0036 →
CHANGE OF NAME Recorded Jan 28, 2009
From: MATSUSHITA ELECTRIC WORKS, LTD.
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 022206/0574 →