IP Library Granted Patent US 8,646,246
Granted Patent B2
US 8,646,246 · App. 12/142,506 · Granted Feb 11, 2014

Method of preparing a composition in blister packages

Inventors: Hewei Li (Beijing, CN); Congwei Wang (Beijing, CN); Bo Du (Beijing, CN); Chenggong Jia (Beijing, CN); Shirong Jiao (Beijing, CN); Chun Ji (Beijing, CN)
Assignee: Quantum Hi-Tech (Beijing) Research Institute
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,646,246
App. No.
12/142,506
Granted
Feb 11, 2014
Kind
B2
Abstract

The present invention provides methods for preparing compositions in blister packages using complex aluminum substrate materials, wherein said complex aluminum substrate materials comprise an intermediate aluminum layer, and first and second outer layers, wherein the material of the first outer layer differs from that of the second outer layer, and the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%.

Claims (17)

1. A method for manufacturing a composition in blister packages, which comprises:

(a) molding a complex aluminum substrate material with blister molding equipment, forming a plurality of depressions in said complex aluminum substrate material, wherein said complex aluminum substrate material comprises an intermediate aluminum layer, and first and second outer layers, wherein the first and second outer layers are composed of materials selected from polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyamide, cyclo olefin copolymer, polyurethane or their mixture, wherein material of the first outer layer differs from that of the second outer layer, and flexural rigidity of the first outer layer differs from that of the second outer layer by 0-30%;

(b) filling a liquid composition into the plurality of depressions formed in step (a);

(c) freezing said composition;

(d) freeze-drying said composition;

(e) attaching a lidding material to said package material to seal said composition,

wherein, the first outer layer comprises an OPA layer and a layer of COC and PE mixture, and the material of the second outer layer is selected from polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyamide, cyclo olefin copolymer, polyurethane or their mixture.

2. The method of claim 1 , wherein the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-15%.

3. The method of claim 2 , wherein the flexural rigidity of the first outer layer differs from that of the second outer layer by 0-5%.

4. The method of claim 3 , wherein the flexural rigidity of the first outer layer and the second outer layer is the same.

5. The method of claim 1 , wherein said first and second outer layers further include multiple sub-layers.

6. The method of claim 1 , wherein the first outer layer comprises an OPA layer and a layer of the COC and PE mixture; the second outer layer comprises an OPA layer and a layer of the COC and PE complex and the structure of the substrate material is COC+PE/OPA/A1/OPA/COC/PE.

7. The method of claim 6 , wherein the thickness of the OPA layer of said first outer layer is the same as that of the OPA layer of the second outer layer, and the thickness of the COC and PE mixture layer of said first outer layer is the same as that of the COC and PE complex layer of said second outer layer.

8. The method of claim 1 , wherein said composition is selected from the group consisting of pharmaceuticals, cosmetics, nutritional supplements, food and seasonings.

9. The method of claim 8 , wherein said composition is pharmaceuticals.

10. The method of claim 1 , wherein said composition is oral disintegrating preparation.

11. The method of claim 1 , wherein the second outer layer comprises an OPA layer and the structure of the substrate material is COC+PE/OPA/A1/OPA.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2015
From: QUANTUM HI-TECH (BEIJING) RESEARCH INSTITUTE
To: BEIJING QUANTUM HI-TECH PHARMACEUTICAL TECHNOLOGY CO., LTD.
Reel/Frame 035060/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 14, 2008
From: LI, HEWEI; WANG, CONGWEI; DU, BO; JIA, CHENGGONG; JIAO, SHIRONG; JI, CHUN
To: QUANTUM HI-TECH (BEIJING) RESEARCH INSTITUTE
Reel/Frame 021680/0782 →
Priority Claims (1)
CN 2005 1 0129999 · Dec 19, 2005 · national
Continuity (2)
Continuation In Part PCTCN2006003487 · Dec 19, 2006
Related Publication 20080305289A1 · Dec 11, 2008