Heat-transfer structure

1. An apparatus, comprising:

a first substrate having a first surface;

a second substrate having a second surface facing the first surface; and

an array of metallic raised features being located on the first surface, each raised feature being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle deformation produced therein via a compressive force, wherein the mechanical bend or buckle deformation via the compressive force produces a compressive pressure in a range of 0.7 to 4.2 MPa.

2. The apparatus of claim 1 , wherein the mechanically deformed metallic raised features provide physical connections between portions of a region of the first surface and the second surface, wherein the region of the first surface is non-planar.

3. The apparatus of claim 1 , wherein each of the metallic raised features form a continuous phase of metal directly connecting the first surface and the second surface.

4. The apparatus of claim 1 , wherein said array is a two-dimensional array of cones or posts.

5. The apparatus of claim 1 , wherein the metallic raised features are fins.

6. The apparatus of claim 1 , wherein each of the metallic raised feature includes two metal layers, each metal layer comprising a different metal.

7. The apparatus of claim 1 , wherein each of said metallic raised features has substantially the same height.

8. The apparatus of claim 1 , wherein the metallic deformable raised features are hollow.

9. The apparatus of claim 1 , wherein there are at least two groups of the metallic deformable raised features having two different heights.

10. The apparatus of claim 1 , wherein one or more of the metallic raised features has a curved surface or a singularity.

11. The apparatus of claim 1 , wherein each substrate includes an integrated circuit.

12. The apparatus of claim 1 , wherein

the first substrate is a first integrated circuit having a first surface; and

the second substrate is a second integrated circuit having a second surface, each of the first and second surfaces being in direct physical contact with deformed ones of the raised features of one of the arrays.

13. The apparatus of claim 1 , wherein each of the raised features have a tapered width towards the second surface.

14. The apparatus of claim 1 , configured for bringing the first surface and the second surface together in response to the compressive force.

15. The apparatus of claim 1 , wherein the compressive force is substantially perpendicular to the first surface and the second surface.

16. The apparatus of claim 1 , wherein the second substrate is a separate heat sink device component and the second surface is a uniform surface that each of the raised features contact directly.

17. An apparatus, comprising:

a metallic planar substrate having a front and back surfaces, the back surface being opposite the front surface;

an array of metallic raised features located directly on each of the surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle deformable via a compressive force applied between a first substrate and a second substrate, wherein the mechanical bend or buckle deformation via the compressive force produces a compressive pressure in a range of 0.7 to 4.2 MPa.

18. The apparatus of claim 17 , wherein each of the metallic raised features form a continuous phase of metal directly connecting the first surface and the second surface.

19. The apparatus of claim 17 , wherein each of the metallic raised feature includes two metal layers, each metal layer comprising a different metal.

20. The apparatus of claim 17 , wherein the metallic deformable raised features are hollow.

21. The apparatus of claim 17 , wherein there are at least two groups of the metallic raised features having two different heights.

22. The apparatus of claim 17 , wherein one or more of the metallic raised features has a curved surface or a singularity.