Image drum and fabricating method thereof
View Patent ↗A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board terminals, mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body, coating a first insulating layer on an outer circumference of the hollow drum body, forming a plurality of ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, in which a portion of ring electrodes which corresponds to the board terminals of the PCB is non-continuous, exposing the board terminals below non-continuous area of the ring electrodes by etching the first insulating layer with the ring electrodes as an etching mask, and forming a connecting electrode to electrically connect the board terminals to the ring electrodes.
1. A method of fabricating an image drum, the method comprising:
preparing a hollow drum body having a slot extending in a longitudinal direction;
preparing a printed circuit board (PCB) comprising board terminals;
mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body;
coating a first insulating layer on an outer circumference of the hollow drum body;
forming non-continuous ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, the non-continuous ring electrodes each having ends disposed adjacent to a corresponding one of the board terminals and on opposite sides of the slot;
exposing the board terminals between the ends of the non-continuous ring electrodes by etching the first insulating layer using the non-continuous ring electrodes as an etching mask; and
forming connecting electrodes to electrically connect the board terminals to the corresponding non-continuous ring electrodes.
2. The method of claim 1 , further comprising:
coating a second insulating layer on an outer circumference of the hollow drum body, the non-continuous ring electrodes, and the connecting electrodes.
3. The method of claim 2 , wherein the second insulating layer is made out of a polycarbonate or parylene.
4. The method of claim 1 , wherein the forming the non-continuous ring electrodes comprises:
coating a conductive layer on the first insulating layer;
coating a photoresist layer on the conductive layer;
forming a photoresist etching mask by selective exposure and developing of the photoresist layer; and
etching the conductive layer with the photoresist etching mask to form the ends of the non-continuous ring electrodes.
5. The method of claim 1 , wherein the hollow drum body is made out of aluminum or an aluminum alloy.
6. The method of claim 1 , wherein the board terminals are spaced apart from each other by a pitch which ranges from about 20 μm to about 50 μm.
7. The method of claim 1 , wherein the fixing member comprises an insulating epoxy adhesive.
8. The method of claim 1 , wherein the first insulating layer is made out of a polycarbonate or parylene.
9. The method of claim 1 , wherein the non-continuous ring electrodes are arranged at a same pitch as that of the board terminals.
10. The method of claim 1 , wherein the non-continuous ring electrodes are spaced apart from each other by a pitch which ranges from about 20 μm to about 50 μm.
11. The method of claim 1 , wherein the non-continuous ring electrodes are made out of copper or nickel.
12. The method of claim 1 , wherein the connecting electrodes are made out of copper or nickel.
13. The method of claim 1 , wherein the forming the connecting electrodes comprises:
aligning a screen mask having a plurality of openings to expose an area of forming the connecting electrode such that the plurality of openings are aligned with the area of forming the connecting electrodes, and placing the screen mask on the drum body; and
providing the surface of the screen mask with conductive particles.
14. The method of claim 13 , wherein the providing the conductive particles comprises one of sputtering, heat deposition, and silk screening.