Manufacturing method of semiconductor device
View Patent ↗In the semiconductor device manufacturing method of the present invention, first, the emissivity of a wafer placed in a chamber is measured. Then, the fluctuation rate of a wafer physical quantity that fluctuates in association with the given thermal energy is calculated based on an estimate expression, which are obtained in advance, presenting the relationship between the thermal energy quantity emitted from the heat source for heating the wafer, wafer emissivity and the wafer physical quantity fluctuation rate and on the measured emissivity. Subsequently, the processing time for the physical quantity to be a specific value is calculated based on the calculated fluctuation rate. Then, the thermal process is conducted for the calculated processing time.
1. A semiconductor device manufacturing method including a step of thermally processing a wafer placed in a chamber, the thermal process comprising the steps of:
measuring an emissivity of a wafer placed in the chamber;
calculating a fluctuation rate of a wafer physical quantity that fluctuates in association with a given thermal energy quantity based on an estimate expression, which are obtained in advance, presenting a relationship between a thermal energy quantity emitted from a heat source for heating the wafer placed in the chamber, wafer emissivity and the wafer physical quantity fluctuation rate and on the measured emissivity;
calculating a processing time for the physical quantity to be a specific value based on the calculated fluctuation rate; and
conducting the thermal process for the calculated processing time,
wherein the estimate expression includes a virtual thermal energy loss, the thermal process is conducted in a lamp heating thermal processing apparatus and the thermal energy loss is calculated based on a pressure in the lamp chamber.
2. A semiconductor device manufacturing method including a step of thermally processing a wafer placed in a chamber, the thermal process comprising the steps of:
measuring an emissivity of a wafer placed in the chamber;
calculating a fluctuation rate of a wafer physical quantity that fluctuates in association with a given thermal energy quantity based on an estimate expression, which are obtained in advance, presenting a relationship between a thermal energy quantity emitted from a heat source for heating the wafer placed in the chamber, wafer emissivity and the wafer physical quantity fluctuation rate and on the measured emissivity;
calculating the wafer physical quantity after a planned processing time based on the estimated physical quantity fluctuation rate and the planned processing time;
evaluation as to whether or not the calculated physical quantity falls within a predetermined range; and
conducting the thermal process when the calculated physical quantity falls within the predetermined range,
wherein the estimate expression includes a virtual thermal energy loss, the thermal process is conducted in a lamp heating thermal processing apparatus and the thermal energy loss is calculated based on a pressure in the lamp chamber.
3. A semiconductor device manufacturing method according to claim 1 , wherein the physical quantity is calculated for several points on the wafer and the thermal process is discontinued when the uniformity of the calculated physical quantities over the wafer surface falls outside a predetermined range.
4. A semiconductor device manufacturing method according to claim 2 , wherein the physical quantity is calculated for several points on the wafer and the thermal process is discontinued when the uniformity of the calculated physical quantities over the wafer surface falls outside a predetermined range.
5. A semiconductor device manufacturing method according to claim 1 , wherein the estimate expression includes the wafer emissivity that depends on a product type of the wafer.
6. A semiconductor device manufacturing method according to claim 2 , wherein the estimate expression includes the wafer emissivity that depends on a product type of the wafer.
7. A semiconductor device manufacturing method including a step of thermally processing a wafer placed in a chamber, the thermal process comprising steps of:
measuring an emissivity of a wafer placed in the chamber;
calculating a fluctuation rate of a wafer physical quantity that fluctuates in association with a given thermal energy quantity based on an estimate expression, which are obtained in advance, presenting a relationship between a thermal energy quantity emitted from a heat source for heating the wafer placed in the chamber, wafer emissivity and the wafer physical quantity fluctuation rate and on the measured emissivity;
calculating a processing time for the physical quantity to be a specific value based on the calculated fluctuation rate; and
conducting the thermal process for the calculated processing time,
wherein the estimate expression includes a virtual thermal energy loss, the thermal process is conducted in a lamp heating thermal processing apparatus and the thermal energy loss is calculated based on a reflectance or emissivity of a reflecting plate placed under the wafer that is changed by a film adhered to the reflecting plate.
8. A semiconductor device manufacturing method including a step of thermally processing a wafer placed in a chamber, the thermal process comprising steps of:
measuring an emissivity of a wafer placed in the chamber;
calculating a fluctuation rate of a wafer physical quantity that fluctuates in association with a given thermal energy quantity based on an estimate expression, which are obtained in advance, presenting a relationship between a thermal energy quantity emitted from a heat source for heating the wafer placed in the chamber, wafer emissivity and the wafer physical quantity fluctuation rate and on the measured emissivity;
calculating the wafer physical quantity after a planned processing time based on the estimated physical quantity fluctuation rate and the planned processing time;
evaluating as to whether or not the calculated physical quantity falls within a predetermined range; and
conducting the thermal process when the calculated physical quantity falls within the predetermined range,
wherein the estimate expression includes a virtual thermal energy loss, the thermal process is conducted in a lamp heating thermal processing apparatus and the thermal energy loss is calculated based on a reflectance or emissivity of a reflecting plate placed under the wafer that is changed by a film adhered to the reflecting plate.
9. A semiconductor device manufacturing method according to claim 7 , wherein the physical quantity is calculated for several points on the wafer and the thermal process is discontinued when the uniformity of the calculated physical quantities over the wafer surface falls outside a predetermined range.
10. A semiconductor device manufacturing method according to claim 8 , wherein the physical quantity is calculated for several points on the wafer and the thermal process is discontinued when the uniformity of the calculated physical quantities over the wafer surface falls outside a predetermined range.
11. A semiconductor device manufacturing method according to claim 7 , wherein the estimate expression includes the wafer emissivity that depends on a product type of the wafer.
12. A semiconductor device manufacturing method according to claim 8 , wherein the estimate expression includes the wafer emissivity that depends on a product type of the wafer.