Laser microdissection method, control system for a laser microdissection device and carrier device

1. A method for performing microdissection, which comprises:

providing a carrier device with a laser light-absorbent incisable layer and a carrier for carrying the laser light-absorbent incisable layer;

applying a preparation on the incisable layer;

selecting a target zone to be separated from the preparation;

cutting the preparation and the incisable layer along an edge segment of the target zone by laser irradiation to subdivide the incisable layer into at least one excised segment and a non-excised segment; and

removing the non-excised segment of the incisable layer from the carrier.

2. The method according to claim 1 , which further comprises:

carrying out the cutting step to excise the target zone; and

removing the non-excised segment of the incisable layer while the target zone remains on the carrier.

3. The method according to claim 2 , which further comprises:

applying the incisable layer displaceably on the carrier; and

centrifuging off the target zone together with the at least one excised segment of the incisable layer from the carrier for further processing of the target zone.

4. The method according to claim 1 , which further comprises:

carrying out the cutting step to excise a preparation segment not containing the target zone; and

removing the target zone from the carrier together with the non-excised segment of the incisable layer when the non-excised segment is removed.

5. The method according to claim 1 , which further comprises carrying out the removing step manually.

6. The method according to claim 1 , wherein the carrier comprises a first incisable layer support and a second support operable to support the first support; and which further comprises configuring the carrier device to dispose the first support substantially between the second support and the incisable layer.

7. The method according to claim 6 , which further comprises removing the first support from the second support after the non-excised segment of the incisable layer is removed from the carrier.

8. The method according to claim 7 , which further comprises manually removing the first support from the second support.

9. The method according to claim 1 , which further comprises

generating an overview image of the preparation;

carrying out the target zone selecting step one of in a user-defined fashion and at least partially automatically based upon the overview image.

10. The method according to claim 1 , wherein the carrier is at least partially transparent; and which further comprises irradiating a laser beam onto the carrier device on the same side as the carrier to cut the preparation and the incisable layer.

11. The method according to claim 1 , which further comprises irradiating a laser beam onto the carrier device on the same side as the incisable layer to cut the preparation and the incisable layer.

12. The method according to claim 1 , wherein the target zone is a plurality of respectively geometrically connected target zone regions having edge segments, and which further comprises cutting the preparation and the incisable layer by laser irradiation along an edge segment of each of the target zone regions before the non-excised segment of the incisable layer is removed.

13. The method according to claim 1 , which further comprises analyzing the target zone by molecular genetics after the non-excised segment of the incisable layer is removed from the carrier.

14. The method according to claim 1 , wherein the preparation is a biological preparation.

15. A method for performing microdissection, comprising:

providing a carrier device with a laser light-absorbent incisable layer and a means for carrying the laser light-absorbent incisable layer;

applying a biological preparation on the incisable layer;

selecting a target zone to be separated from the preparation;

cutting the preparation and the incisable layer along an edge segment of the target zone by laser irradiation to subdivide the incisable layer into at least one excised segment and into a non-excised segment; and

removing the non-excised segment of the incisable layer from the carrier means.