Semiconductor device and method of fabricating the semiconductor device
View Patent ↗A semiconductor device comprises a gate electrode on a semiconductor substrate, drift regions at opposite sides of the gate electrode, source and drain regions in the respective drift regions, and shallow trench isolation (STI) regions in the respective drift regions between the gate electrode and the source or drain region, wherein the drift regions comprise first and second conductivity-type impurities.
1. A method of fabricating a semiconductor device, comprising:
forming a first impurity region by implanting first conductive impurities having a first conductivity type into a semiconductor substrate at a first energy;
forming a second impurity region by implanting second conductive impurities having a second conductivity type into the semiconductor substrate at a second energy;
forming a third impurity region by implanting third conductive impurities having the first conductivity type into the semiconductor substrate at a third energy;
forming a drift region by diffusing the first, second, and third impurity regions;
forming a gate electrode on the semiconductor substrate;
forming source and drain regions by heavily implanting fourth conductive impurities having the first conductivity type into the drift region; and
forming a shallow trench isolation region by selectively etching a portion of the drift region between the gate electrode and the source region or the drain region and filling the etched portion with an insulation material.
2. The method according to claim 1 , wherein the first energy is higher than the second and third energies, and the third energy is higher than the second energy.
3. The method according to claim 1 , wherein a concentration of the second conductive impurities gradually reduces as a depth under the shallow trench isolation region increases.
4. The method according to claim 1 , wherein a concentration of the first conductive impurities gradually increases and then reduces as a depth under the shallow trench isolation region increases.
5. The method according to claim 1 , wherein a plurality of electron paths in the drift regions form at a location of a strongest electric field.
6. The method according to claim 1 , wherein an amount of the first conductive impurities is greater than that of the second conductive impurities.
7. The method according to claim 1 , wherein the second conductive impurities are under the shallow trench isolation region, and the first conductive impurities are under the second conductive impurities.
8. The method according to claim 1 , wherein diffusing the first, second, and third impurity regions comprises heating the semiconductor substrate.
9. The method according to claim 1 , comprising forming a plurality of first impurity regions by implanting the first conductive impurities into a plurality of regions in the semiconductor substrate.
10. The method according to claim 9 , comprising forming a plurality of second impurity regions by implanting the second conductive impurities into the plurality of regions in the semiconductor substrate.
11. The method according to claim 10 , comprising forming a plurality of third impurity regions by implanting the third conductive impurities into the plurality of regions in the semiconductor substrate.
12. The method according to claim 11 , comprising forming a plurality of drift regions by diffusing the pluralities of first, second, and third conductive impurities.
13. The method according to claim 12 , comprising forming the source region in a first drift region and the drain region in a second drift region by heavily implanting the fourth conductive impurities into the first and second drift regions.
14. The method according to claim 13 , comprising forming a plurality of shallow trench isolation regions by selectively etching a portion of each of the first and second drift regions between the gate electrode and the source region or the drain region, and filling the etched portions with the insulation material.