IP Library Granted Patent US 7,768,796
Granted Patent B2
US 7,768,796 · App. 12/147,218 · Granted Aug 3, 2010

Die module system

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Quick Facts
Patent No.
US 7,768,796
App. No.
12/147,218
Granted
Aug 3, 2010
Kind
B2
Abstract

A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Claims (11)

1. A circuit module comprising:

a flexible circuit having a first major side and a second major side, the flexible circuit exhibiting along the first major side, first-side first and second sets of contact site arrays between which is located at least one row of connector contacts, the second major side of the flexible circuit exhibiting second-side first and second sets of contact site arrays, each of the first-side and second-side first and second sets of contact site arrays comprising at least two surface mount arrays;

a first plurality of CSPs that populate the at least two surface mount arrays of the first-side first and second sets of contact site arrays and a second plurality of CSPs that populate the at least two surface mount arrays of the second-side first and second sets of contact site arrays, respectively;

a substrate comprised from metallic material and having an end about which the flexible circuit is disposed to place the second plurality of CSPs closer to the substrate than are disposed the first plurality of CSPs.

2. The circuit module of claim 1 in which the substrate has at least one extension.

3. The circuit module of claim 1 further comprising an advanced memory buffer disposed on the first side of the flexible circuit.

4. The circuit module of claim 1 further comprising an advanced memory buffer disposed on the second side of the flexible circuit.

5. The circuit module of claim 1 in which the first and second pluralities of CSPs are comprised of memory circuit CSPs.

6. The circuit module of claim 1 connected to a main circuit board employed in a computer.

7. The circuit module of claim 6 in which the computer is a server computer.

8. The circuit module of claim 6 in which the computer is a notebook computer.

Assignments (6)
MERGER Recorded Dec 27, 2015
From: OVID DATA CO. LLC
To: TAMIRAS PER PTE. LTD., LLC
Reel/Frame 037373/0481 →
CORRECTION TO THE RECORDATION COVER SHEET OF THE ASSIGNMENT RECORDED AT REEL/FRAME 021457/0284. THE NAME OF THE ASSIGNEE IS STAKTEK GROUP L.P. Recorded Feb 28, 2013
From: CADY, JAMES W.; GOODWIN, PAUL
To: STAKTEK GROUP L.P.
Reel/Frame 029902/0077 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2012
From: ENTORIAN TECHNOLOGIES INC.
To: OVID DATA CO. LLC
Reel/Frame 029389/0672 →
MERGER Recorded Oct 25, 2012
From: ENTORIAN TECHNOLOGIES L.P.
To: ENTORIAN GP LLC
Reel/Frame 029195/0048 →
MERGER Recorded Oct 25, 2012
From: ENTORIAN GP LLC
To: ENTORIAN TECHNOLOGIES INC.
Reel/Frame 029195/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 28, 2008
From: CADY, JAMES W.; GOODWIN, PAUL
To: ENTORIAN TECHNOLOGIES, L.P. (FORMERLY STAKTEK GROUP, L.P.)
Reel/Frame 021457/0284 →