IP Library Granted Patent US 8,820,095
Granted Patent B2
US 8,820,095 · App. 12/147,366 · Granted Sep 2, 2014

Vortex-based temperature control system and method

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Quick Facts
Patent No.
US 8,820,095
App. No.
12/147,366
Granted
Sep 2, 2014
Kind
B2
Abstract

A vortex-based temperature control system comprises a test chamber configured to receive a test article therein, a sensor disposed within the test chamber for detecting a temperature within the test chamber, a first vortex tube coupled to the test chamber for providing a heating airflow to the test chamber, and a second vortex tube coupled to the test chamber for providing a cooling airflow to the test chamber. The system also comprises a temperature controller coupled to the sensor and configured to control an airflow delivered to the first and second vortex tubes to obtain a desired temperature setting within the test chamber.

Claims (52)

1. A vortex-based temperature control system, comprising:

a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;

a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;

a sensor disposed within the chamber for detecting a temperature within the chamber;

a first vortex tube coupled to the chamber for providing a heating airflow to the chamber;

a second vortex tube coupled to the chamber for providing a cooling airflow to the chamber;

an air supply coupled to the first and second vortex tubes, wherein the air supply comprises:

a booster configured to increase a pressure of an airflow deliverable to the first and second vortex tubes;

a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; and

a pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the first and second vortex tubes; and

a temperature controller coupled to the sensor and configured to control an airflow delivered to the first and second vortex tubes to obtain a desired temperature setting within the chamber.

2. The system of claim 1 , further comprising at least one airflow control device controllable by the temperature controller to regulate an airflow delivered to at least one of the first and second vortex tubes.

3. The system of claim 1 , further comprising a plurality of solenoid valves coupled to the temperature controller and each respectively coupled to the first and second vortex tubes, wherein actuation of at least one of the plurality of solenoid valves is controlled by the temperature controller to control the airflow delivered to the respective first and second vortex tubes.

4. The system of claim 1 , further comprising a mass flow controller coupled to the temperature controller and controllable by the temperature controller to vary an airflow rate deliverable to at least one of the first and second vortex tubes.

5. The system of claim 1 , further comprising a pressure controller coupled to the temperature controller and controllable by the temperature controller to control a volume of airflow deliverable to at least one of the first and second vortex tubes.

6. The system of claim 1 , further comprising a plurality of pressure controllers coupled to the temperature controller and each respectively coupled to the first and second vortex tubes, wherein the temperature controller is configured to control the plurality of pressure controllers to control the airflow delivered to the respective first and second vortex tubes.

7. The system of claim 1 , further comprising a mixing valve actuatable to control the airflow delivered to the first and second vortex tubes.

8. The system of claim 1 , wherein the temperature controller is configured to control airflow delivered to the first and second vortex tubes to change a temperature within the chamber between an above-ambient temperature and a below-ambient temperature without cessation of testing the optical transceiver or VCSEL within the chamber.

9. The system of claim 1 , wherein the temperature controller is configured to control airflow delivered to the first and second vortex tubes to change a temperature within the chamber between an above-ambient temperature and a below-ambient temperature without opening the chamber.

10. The system of claim 1 , wherein the temperature controller comprises a proportional-integral-derivative (PI D) controller.

11. The system of claim 1 , further comprising at least one muffler coupled to at least one of the first and second vortex tubes.

12. The system of claim 1 , further comprising a chilling device disposed upstream along an airflow path from the second vortex tube.

13. A vortex-based temperature control system, comprising:

a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;

a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;

a sensor directly exposed to air within the chamber for detecting a temperature of the air within the chamber;

a vortex tube coupled to the chamber for providing an airflow to the chamber, the airflow comprising a heating airflow;

an air supply coupled to the vortex tube, wherein the air supply comprises:

a booster configured to increase a pressure of the airflow deliverable to the vortex tube;

a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; and

a pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the vortex tube;

a pressure controller located within an airflow path between the air supply and the vortex tube; and

a temperature controller coupled to the sensor and the pressure controller, the temperature controller configured to control the pressure controller to control a rate of airflow delivered to the vortex tube to obtain a desired temperature setting within the chamber.

14. The system of claim 13 , further comprising a valve disposed in the airflow path between the pressure controller and the vortex tube, the temperature controller configured to control actuation of the valve for providing an airflow to the vortex tube.

15. The system of claim 13 , wherein an inlet to the vortex tube is coupled to an outlet of another vortex tube.

16. The system of claim 13 , wherein the temperature controller comprises a proportional-integral-derivative (PI D) controller.

17. The system of claim 13 , further comprising a chilling device disposed upstream along an airflow path from the vortex tube.

18. A vortex-based temperature control system, comprising:

a chamber that at least partially encloses an optical transceiver or vertical cavity surface emitting laser (VCSEL) to be tested;

a printed circuit board to which the optical transceiver or VCSEL is mounted, wherein the printed circuit board is configured to enable operation of the optical transceiver or VCSEL while the optical transceiver or VCSEL is at least partially enclosed within the chamber;

a sensor directly exposed to air within the chamber for detecting a temperature of the air within the chamber;

a vortex tube coupled to the chamber for providing an airflow to the test chamber, the airflow comprising a heating airflow;

an air supply coupled to the vortex tube, wherein the air supply comprises:

a booster configured to increase a pressure of the airflow deliverable to the vortex tube;

a capacity tank coupled to receive an output of the booster and configured to store pressurized gas; and

a pressure regulator coupled to receive an output of the capacity tank and configured to control the pressure of the airflow released downstream to the vortex tube;

a mass flow controller located within an airflow path between the air supply and the vortex tube; and

a temperature controller coupled to the sensor and the mass flow controller, the temperature controller configured to control the mass flow controller to control a rate of airflow delivered to the vortex tube to obtain a desired temperature setting within the chamber.

19. The system of claim 18 , further comprising a valve disposed in the airflow path between the mass flow controller and the vortex tube, the temperature controller configured to control actuation of the valve for providing an airflow to the vortex tube.

20. The system of claim 18 , wherein an inlet to the vortex tube is coupled to an outlet of another vortex tube.

21. The system of claim 18 , wherein the temperature controller comprises a proportional-integral-derivative (PID) controller.

22. The system of claim 18 , further comprising a chilling device disposed upstream along an airflow path from the vortex tube.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →