Granted Patent B2

US 8,286,693 · App. 12/148,192 · Granted Oct 16, 2012

Abstract

Claims (35)

1. A heat sink assembly comprising:

a base plate having a top surface and a bottom surface, the bottom surface having an open channel formed therein, the channel having at least one first region and a second region;

at least one heat pipe contained in said open channel, each said heat pipe comprising at least one evaporator section and at least one condenser section, wherein the at least one evaporator section and at least one condenser section are arranged in the open channel such that a common plane that is parallel to a plane of the bottom surface at the second region passes through both the at least one evaporator section and the at least one condenser section, and wherein at least two evaporator sections are juxtaposed side by side in the second region of said channel, and each said condenser section is in a respective said first region of said channel; and

a heat dissipating element which dissipates heat from said top surface of said base plate, said heat dissipating element comprising one of cooling fins and a cold plate on said top surface,

wherein said evaporator sections include portions in the second region that are flush with the plane of the bottom surface at the second region, and all portions of the at least one condenser section are recessed below a plane of the bottom surface at the first region.

2. The heat sink assembly of claim 1 wherein the juxtaposed evaporator sections have a collective width which is substantially equal to a second width of the second region.

3. The heat sink of claim 2 wherein said second region has a substantially rectangular profile, said evaporator sections being collectively formed to said substantially rectangular profile.

4. The heat sink assembly of claim 1 wherein said at least one heat pipe comprises two discrete heat pipes, each said heat pipe having at least one evaporator section in said second region.

5. The heat sink assembly of claim 4 wherein each said heat pipe comprises a U-shaped section having a first arm forming said condenser section and a second arm forming said evaporator section, wherein the first arm and the second arm are connected by a bight.

6. The heat sink of claim 5 wherein one of said U-shaped sections is formed with a hooked end which extends parallel to said second arm of said one of said U-shaped sections and forms an evaporator section, said second arms and said hooked end lying in said second region of said channel.

7. The heat sink of claim 1 wherein said at least one heat pipe is a single heat pipe having a plurality of evaporator sections in said second region.

8. The heat sink of claim 7 wherein said heat pipe is formed as an S-shaped section with a pair of hooked ends and a center section which form said evaporator sections.

9. The heat sink of claim 1 wherein, in said second region, said evaporator sections are arranged to be coplanar with said bottom surface at the second region.

10. The heat sink of claim 1 wherein each said first region of said channel is filled with one of solder and epoxy over said condenser section.

11. The heat sink of claim 1 wherein the channel has a floor, the floor in the second region being raised with respect to the floor in the first region.

12. The heat sink of claim 1 wherein the channel is formed substantially in the shape of a pair of juxtaposed ovals.

13. The heat sink of claim 1 wherein the at least one condenser section is flattened to have a substantially oval profile.

14. The heat sink of claim 1 wherein said at least one heat pipe is soldered in said channel.

15. The heat sink of claim 1 wherein said at least one heat pipe contains a fluid which is present in two phases, said at least one heat pipe being lined with a wicking structure which draws condensate of the fluid from the condenser sections toward the evaporation sections regardless of orientation of the heat sink.

16. A heat sink assembly comprising:

a base plate having a top surface and a bottom surface, the bottom surface having an open channel formed therein, the channel having at least one first region with a floor and a second region with a floor; and

at least one heat pipe including at least one evaporator section and at least one condenser section arranged in the open channel such that a common plane that is parallel to a plane of the bottom surface at the second region passes through both the at least one evaporator section and the at least one condenser section, said at least one heat pipe having a surface that is flush with said bottom surface in said second region, and said at least one heat pipe having all portions of a condenser section recessed below said bottom surface in said at least one first region.

17. The heat sink assembly of claim 16 wherein said at least one heat pipe is machined flush with said bottom surface over said second region.

18. The heat sink assembly of claim 16 wherein the floor in the second region is raised with respect to the floor in the at least one first region.

19. The heat sink assembly of claim 16 wherein said at least one heat pipe comprises two sections, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in said second region of the channel, and said condenser sections are in respective said first regions of said channel.

20. The heat sink assembly of claim 16 further comprising a heat dissipating element which dissipates heat from said top surface of said base plate, said heat dissipating element comprising one of cooling fins and a cold plate located on said top surface.

21. The heat sink assembly of claim 1 , wherein the open channel is fully contained within the bottom surface of the base plate.

22. A heat sink assembly comprising:

a base plate having a top surface and a bottom surface, the bottom surface having an open channel formed therein, the channel having at least one first region and a second region;

at least one heat pipe contained in said open channel, each said heat pipe comprising at least one evaporator section and at least one condenser section, wherein at least one evaporator section is positioned in the second region of said channel, and each said at least one condenser section is in a respective said first region of said channel, the at least one evaporator section and at least one condenser section being arranged in the open channel such that a common plane that is parallel to a plane of the bottom surface at the second region passes through both the at least one evaporator section and the at least one condenser section, said at least one heat pipe having a surface that is flush with said bottom surface in said second region, and said at least one heat pipe having all portions of a condenser section recessed below said bottom surface in said at least one first region; and

a heat dissipating element which dissipates heat from said top surface of said base plate, said heat dissipating element comprising one of cooling fins and a cold plate on said top surface,

wherein portions of said at least one evaporator section that are positioned nearest a plane of the bottom surface at the second region have a thinner wall thickness than portions of the at least one condenser section that are positioned nearest a plane of the bottom surface at a respective first region.

23. The heat sink assembly of claim 22 , wherein at least two evaporator sections are juxtaposed side by side in the second region of said channel.

24. The heat sink assembly of claim 23 , wherein the juxtaposed evaporator sections have a collective width which is substantially equal to a second width of the second region.

25. The heat sink assembly of claim 22 , wherein said at least one heat pipe comprises two discrete heat pipes, each said heat pipe having at least one evaporator section in said second region.

Assignments (12)