IP Library Granted Patent US 7,999,018
Granted Patent B2
US 7,999,018 · App. 12/148,873 · Granted Aug 16, 2011

Thermoplastic resin composition having electromagnetic interference shielding properties

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Quick Facts
Patent No.
US 7,999,018
App. No.
12/148,873
Granted
Aug 16, 2011
Kind
B2
Abstract

A thermoplastic resin composition having good electromagnetic shielding properties and high stiffness comprising thermoplastic polymer, metal alloy having a melting point of between about 200° C. and 500° C.

Claims (27)

1. A thermoplastic resin composition comprising:

(a) about 30 to about 78 volume percent of at least one thermoplastic polymer;

(b) about 2 to about 20 volume percent of at least one metal alloy having a melting point of between about 200° C. and 500° C., wherein said metal alloy is at least one selected from the group consisting of Sn—Cu, Sn—Al, Sn—Zn, Sn—Te, Sn—Pt, Su—P, Sn—Mn, Sn—Ag, Sn—Ca, Sn—Mg, Sn—Au, Sn—Ba, Sn—Ge, Al—Li, Cu—Li, and Zn—Li; and

(c) greater than 20 to about 50 volume percent of carbon fibers, having a thermal conductivity of less than 50 W/mK,

wherein the volume percentages are based on the total volume of the composition.

2. The composition of claim 1 , wherein (b) is at least one metal alloy having a melting point of between about 200° C. and about 400° C.

3. The composition of claim 1 , wherein the carbon fibers (c) comprise polyacrylonitrile fibers, pitch fibers, cellulose fibers, and/or carbon nanotubes.

4. The composition of claim 1 , wherein the thermoplastic polymer comprises at least one polyamide.

5. The composition of claim 4 , wherein the polyamide is one or more selected from the group consisting of polyamide 6; polyamide 6, 6; polyamide 4, 6; polyamide 6, 9; polyamide 6, 10; polyamide 6, 12; polyamide 10, 10; polyamide 11; polyamide 12; semi-aromatic polyamides such as poly(m-xylylene adipamide) (polyamide MXD, 6), poly(dodecamethylene terephthalamide) (polyamide 12, T), poly(decamethylene terephthalamide) (polyamide 10, T), poly(nonamethylene terephthalamide) (polyamide 9, T), the copolyamide of hexamethylene terephthalamide and hexamethylene adipamide (polyamide 6, T/6, 6); the copolyamide of hexamethyleneterephthalamide and 2-methylpentamethyleneterephthalamide (polyamide 6, T/D, T); the copolyamide of hexamethylene isophthalamide and hexamethylene adipamide (polyamide 6, I/6, 6); and the copolyamide of hexamethylene terephthalamide, hexamethylene isophthalamide, and hexamethylene adipamide (polyamide 6,T/6, I/6, 6),

6. The composition of claim 1 , wherein the thermoplastic polymer comprises at least one polyester.

7. The composition of claim 6 , wherein the polyester is one or more selected from the group consisting of poly(ethylene terephthalate), poly(1, 4-butylene terephthalate), poly(propylene terephthalate), poly(1, 4-butylene naphthalate), poly(ethylene naphthalate), and poly(1, 4-cyclohexylene dimethylene terephthalate).

8. The composition of claim 1 , further comprising powders of at least one metal, where the metal is not a metal alloy having a melting point of between about 200° C. and about 500° C.

9. The composition of claim 8 , wherein the metal powders are one or more selected from the group consisting of iron, copper, tin, nickel, aluminum, magnesium, titanium, chromium, zinc, gold, and silver.

10. A thermoplastic resin composition comprising:

(a) about 30 to about 88 volume percent of at least one thermoplastic polymer;

(b) about 2 to about 20 volume percent of at least one metal alloy having a melting point of between about 200° C. and 500° C., wherein said metal alloy is at least one selected from the group consisting of Sn—Cu, Sn—Al, Sn—Zn, Sn—Te, Sn—Pt, Su—P, Sn—Mn, Sn—Ag, Sn—Ca, Sn—Mg, Sn—Au, Sn—Ba, Sn—Ge, Al—Li, Cu—Li, and Zn—Li; and

(c) about 10 to about 50 volume percent of carbon fibers having a thermal conductivity of less than 50 W/mK,

wherein the volume percentages are based on the total volume of the composition.

11. The composition of claim 10 , wherein (b) is at least one metal alloy having a melting point of between about 200° C. and about 400° C.

12. The composition of claim 10 , wherein the carbon fibers (c) comprise polyacrylonitrile fibers, pitch fibers, cellulose fibers, and/or carbon nanotubes.

13. The composition of claim 10 , further comprising powders of at least one metal, where the metal is not a metal alloy having a melting point of between about 200° C. and about 500° C.

14. The composition of claim 13 , wherein the metal powders are one or more selected from the group consisting of iron, copper, tin, nickel, aluminum, magnesium, titanium, chromium, zinc, gold, and silver.

15. The composition of claim 10 , wherein the thermoplastic polymer comprises at least one polyamide and/or polyester.

16. A article made from the composition of claim 1 .

17. The article of claim 16 in the form an electrical or electronic housing, a motor core housing, or secondary battery case.

18. A article made from the composition of claim 10 .

19. The article of claim 18 in the form an electrical or electronic housing, a motor core housing, or secondary battery case.

Assignments (3)
CHANGE OF NAME Recorded Feb 11, 2026
From: DUPONT POLYMERS, INC.
To: CELANESE POLYMERS HOLDING, INC.
Reel/Frame 074734/0498 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT POLYMERS, INC.
Reel/Frame 049590/0650 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2009
From: SAGA, YUJI
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 023635/0335 →